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ST11210 Silicon Carbide Planar Target, SiC Target

Catalogue Number ST11210
Composition SiC
Purity ≥99.9%, or customized
Form Target
Shape Rectangular
Dimensions Customized

Silicon Carbide Planar Target, SiC Target is engineered for sputtering applications requiring material stability at elevated temperatures. Stanford Advanced Materials (SAM) employs controlled synthesis processes and scanning electron microscopy inspections to verify microstructure uniformity and impurity levels. The target's planar geometry and customizable dimensions facilitate integration into sputtering systems, ensuring material consistency for ceramic and semiconductor process environments.

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FAQ

What technical advantages does silicon carbide offer as a sputtering target?

The chemical inertness and high melting point of silicon carbide support stable behaviour during sputtering. These properties minimise target degradation and maintain uniform film deposition, which is essential for precise manufacturing processes in semiconductor and ceramic applications.

How do customised dimensions affect the integration of the SiC target in sputtering systems?

Customized dimensions ensure the target fits precisely into various sputtering chamber designs. This tailored fit optimises energy distribution and deposition uniformity, reducing process variability and enhancing overall sputtering performance.

What quality control measures are implemented during the production of the SiC target?

Quality control measures include scanning electron microscopy (SEM) inspections and impurity level analysis. These methods verify microstructural consistency and surface finish, ensuring that the target meets stringent requirements for sputtering deposition processes.

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