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Stanford Advanced Materials
  • Home
  • Elements
  • Tin
  • ST11212 Tin Rotary Target, Sn Target

    • ST11212 Tin Rotary Target, Sn Target

    Catalogue Number ST11212
    Composition Sn
    Purity ≥99.99%, or customized
    Form Target
    Shape Tubular
    Dimensions Customized

    Tin Rotary Target, Sn Target is a sputtering material produced from high-purity tin, optimised for controlled film deposition processes. Stanford Advanced Materials (SAM) employs vacuum arc remelting and microscopic surface verification to achieve consistent microstructural properties and minimise inclusions. SAM uses quantitative metallographic evaluations to ensure adherence to strict composition and dimensional tolerances. The quality control process minimises impurities and supports predictable deposition outcomes.

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    FAQ

    What factors influence the deposition uniformity during sputtering with tin rotary targets?

    Deposition uniformity depends on the target’s surface integrity, consistent composition, and rotational speed. The precise control of these parameters minimises particulate formation and ensures even film thickness across substrates.

    How do manufacturing tolerances of tin rotary targets affect coating quality?

    Tight tolerances in composition and dimension ensure uniform behaviour in sputtering. Enhanced quality verification methods, such as microstructural analysis, support consistency in film thickness and reduce defects during the coating process.

    What precautions must be taken to handle tin rotary targets and avoid contamination?

    It is essential to use anti-static gloves and store targets in a clean, temperature-controlled environment. Proper handling and packaging measures prevent oxidation and surface contaminants, thereby maintaining sputtering performance.

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