ST7952 Molybdenum Sputtering Target 99.9%, Dia. 2 inch

Molybdenum Sputtering Target 99.9%, Dia. 2 inch Description

Our Molybdenum Sputtering Target is distinguished by its purity of 99.9% (Mo), precisely fabricated into a disc measuring 2 inches in diameter. Molybdenum is recognised for its high melting point, substantial mechanical strength, and excellent corrosion resistance, making it a versatile material for thin-film deposition applications. These characteristics ensure reliable performance across industries such as semiconductor manufacturing, solar cell production, and advanced coatings for aerospace components.

Manufactured in accordance with strict quality standards, this target undergoes thorough inspection to ensure a uniform structure and minimal impurities. Its high density and low gas content promote efficient production of even, stable layers, thereby reducing the likelihood of defects. Choose our Molybdenum Sputtering Target for consistent film deposition, optimised throughput, and the assurance that comes from using a trusted, high-quality material.

Molybdenum Sputtering Target 99.9%, Dia. 2 inch Applications

The Molybdenum Sputtering Target 99.9% Dia. 2 inch is extensively used in various industries for the creation of thin films and coatings. With its high melting point, excellent thermal stability, and notable electrical conductivity, Mo ensures consistent and uniform thin film deposition. Its superior corrosion resistance and mechanical strength facilitate long-term performance, making it an essential material for advanced applications in electronics, optics, and beyond.

1. Thin Film Deposition Applications

·         PVD Coating: The high conductivity and stability of Mo enable durable, uniform coatings for components in aerospace and industrial settings.

·         Magnetron Sputtering: Mo’s thermal and mechanical robustness ensures minimal contamination and improved deposition control.

·         Wear-Resistant Films: The substantial hardness of Mo offers enhanced protection for parts operating in demanding environments.

2. Semiconductor Applications

·         Integrated Circuits: Mo’s stability at high temperatures and strong adhesion properties facilitate ultra-thin film formation on silicon wafers.

·         Gate Electrodes: Low resistivity and excellent structural integrity enable precise control of electronic signals.

·         Shielding Layers: Mo’s corrosion resistance protects sensitive features in advanced semiconductor manufacturing.

3. Optical Coating Applications

·         Anti-reflective Coatings: Mo’s uniform sputtering characteristics assist in achieving precise thickness control for improved transmission.

·         Mirror Coatings: Enhanced reflectivity and durability support high-performance optical systems.

·         Beam Splitters: The stable optical properties of Mo ensure reliable light path management in sophisticated optical devices.

Molybdenum Sputtering Target 99.9%, Dia. 2 inch Packaging

The Molybdenum Sputtering Target 99.9%, Dia. 2 inch, is packaged with foam or bubble wrap to minimise impact. It is vacuum-sealed in a moisture-resistant film to prevent oxidation, supplemented by anti-corrosion packets. Each label includes product specifications and handling guidelines. Customised packaging solutions, such as specialised inserts or private labelling, are available to meet specific requirements. This ensures the target’s integrity and extended shelf life.

Packaging: Vacuum sealed, Wooden Box, or Customised.

Molybdenum Sputtering Target 99.9%, Dia. 2 inch FAQs

Q1: What are the key material properties of Molybdenum Sputtering Target 99.9%, Dia. 2 inch?

A1: This Molybdenum sputtering target, with a purity of 99.9%, exhibits a high melting point (2623°C), excellent thermal and electrical conductivity, and strong corrosion resistance. It features a fine-grained microstructure that promotes uniform thin film deposition. The density typically approaches 10.22 g/cm³, ensuring low porosity. High purity reduces impurities that can degrade film quality, making it ideal for semiconductor, display, and solar applications.

Q2: How can this Mo sputtering target be processed or fabricated?

A2: Typically, these targets are produced using powder metallurgy or vacuum arc-casting methods. Powder metallurgy involves milling high-purity molybdenum powder, pressing it into a desired form, and sintering under high temperature to achieve the required density. Arc-casting can yield high-purity ingots that are then rolled, forged, or machined into final shapes. Both processes rely on controlled heating and cooling to minimise grain size and ensure uniform material properties.

Q3: Which quality standards and certifications apply to Molybdenum Sputtering Target 99.9%, Dia. 2 inch?

A3: These Molybdenum sputtering targets typically comply with ASTM B386 specifications for molybdenum plate, sheet, and foil. Manufacturers often hold ISO 9001 certifications to ensure consistent production and quality management. Analytical tests, such as GD-MS or ICP, are conducted to verify purity levels of 99.9% or higher. Material traceability and compliance with RoHS regulations may also be provided, demonstrating adherence to strict international requirements for safety and environmental responsibility.

Related Information

1. Raw Materials - Mo Materials

Mo is a valuable material used in various sputtering applications. It is extracted and purified through advanced processing operations. Stanford Advanced Materials sources high-grade materials from reliable suppliers, ensuring quality and consistency in our sputtering target products.

2. Sputtering Target Manufacturing

Several methods are used to produce Mo sputtering targets, including powder metallurgy. Each method results in different target characteristics such as density, grain structure, and surface properties. The manufacturing method is selected based on the intended application requirements and performance specifications.