Molybdenum Rotary Target 99.95%, Dia. 5 inch Description
Our Molybdenum Rotary Target (99.95%) with a 5-inch diameter exemplifies high-quality manufacturing and purity. Produced under stringent quality controls, this target offers crucial properties such as excellent thermal conductivity, high temperature strength, and substantial corrosion resistance. Its physical robustness and low impurity levels make it suitable for a variety of advanced technological applications, including thin film deposition, semiconductor manufacturing, and optical coating processes. Designed to enable consistent film quality, it provides reliable performance in challenging environments where precision and durability are critical.
Manufactured with careful attention to detail, our Molybdenum Rotary Target meets or exceeds industry standards by undergoing comprehensive inspections for composition and uniformity. The outcome is a product that ensures high sputtering yields and contributes to efficient, accurate production across multiple sectors. Trust in our quality and rely on the durability of this solution for your research and manufacturing requirements.
Molybdenum Rotary Target 99.95%, Dia. 5 inch Applications
The Molybdenum Rotary Target 99.95% purity, with a 5-inch diameter, is a highly versatile sputtering material known for its strength, corrosion resistance, and high melting point. This combination of properties makes it ideal for various thin film, semiconductor, and optical applications that require reliable performance under demanding conditions. Here are some key applications that highlight its benefits.
1. Thin Film Deposition Applications
· PVD Coating: The high purity of molybdenum ensures uniform film thickness and consistent layer adhesion, even under challenging vacuum conditions.
· Magnetron Sputtering: Molybdenum’s hardness and thermal stability enable effective ion bombardment, leading to improved film density and enhanced coating quality.
· Ion Beam Sputtering: Excellent sputtering rates and minimal contamination facilitate precise deposition control in complex multilayer structures.
2. Semiconductor Applications
· Integrated Circuits: Molybdenum layers act as effective diffusion barriers, maintaining the integrity of device interconnects in high-temperature processes.
· Gate Electrodes: Stable electrical properties make molybdenum an appropriate material for MOSFET gates, ensuring reliable transistor performance.
· Thin Film Transistors: The high conductivity and low contact resistance of molybdenum contribute to faster switch speed and reduced power consumption.
3. Optical Coating Applications
· Anti-reflective Coatings: Molybdenum-based films minimise light reflection and enhance optical transparency, improving the efficiency of optical devices.
· Beam Splitters: Consistent layer thickness and strong bonding of molybdenum coatings ensure the durability and precision of optical components.
· High-reflectivity Mirrors: Molybdenum’s reflective properties and corrosion resistance help produce long-lasting, effective mirror surfaces.
Molybdenum Rotary Target 99.95%, Dia. 5 inch Packaging
Each Molybdenum Rotary Target (99.95%, Dia. 5 inch) is protected with foam or shock-absorbent wrapping to prevent mechanical damage. The target is then sealed in a vacuum pouch, reducing oxidation and contamination. An additional protective layer slows corrosion caused by environmental factors. We offer packaging customisation, including specific carton sizes and labelling. All packaging ensures maximum protection during transport and storage, maintaining the target’s purity and performance integrity.
Packaging: Vacuum sealed, Wooden Box, or Customised.
Molybdenum Rotary Target 99.95%, Dia. 5 inch FAQs
Q1: What are the key material properties of Molybdenum Rotary Target 99.95%, Dia. 5 inch?
A1: With a minimum chemical purity of 99.95%, this molybdenum rotary target provides excellent thermal and electrical conductivity, ensuring uniform sputtering performance. Its density of approximately 10.2 g/cm³ contributes to high mechanical strength and stability, even at elevated temperatures. Additionally, the high melting point of molybdenum (2,623°C) ensures excellent heat resilience, thereby reducing the risk of target distortion. Low outgassing rates further enhance performance in vacuum processes.
Q2: What are the recommended processing and fabrication methods for this Mo sputtering target?
A2: Fabrication typically begins with powder metallurgy, where high-purity molybdenum powder is pressed, sintered, and hot isostatically pressed to maximise density. To achieve the rotary target shape, advanced CNC machining and precision grinding are employed, ensuring tight dimensional tolerances. In some cases, forging or rolling is used to refine grain structure. Proper stress relief annealing is crucial for enhancing mechanical strength and maintaining consistent sputtering results.
Q3: Which quality standards and certifications apply to Molybdenum Rotary Target 99.95%, Dia. 5 inch?
A3: These molybdenum rotary targets often comply with ASTM B386 or ASTM B387 for chemical composition and mechanical properties. Manufacturers typically hold ISO 9001 certification, ensuring rigorous quality management practices throughout production and inspection. Key checks include grain size assessment, ultrasonic testing, and dimensional verification to guarantee structural integrity. Detailed material traceability records further validate consistency and compliance with customer specifications.
Related Information
1. Raw Materials - Mo Materials
Molybdenum is a valuable material used in various sputtering applications. It is extracted and purified through advanced processing operations. Stanford Advanced Materials sources high-grade materials from reliable suppliers, ensuring quality and consistency in our sputtering target products.
2. Sputtering Target Manufacturing
Several methods are employed to produce Mo sputtering targets, including powder metallurgy. Each method results in different target characteristics such as density, grain structure, and surface properties. The manufacturing method is selected based on the intended application requirements and performance specifications.
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