ST9141 High Purity Silver Sputtering Target (4N)

High Purity Silver Sputtering Target (4N) Description

Our High Purity Silver Sputtering Target (4N) is meticulously crafted to ensure 99.99% pure silver composition. This exceptional purity lowers the risk of contaminants and guarantees excellent electrical conductivity, making it an ideal choice for critical applications in the semiconductor, electronics, and optical industries. Its uniform grain structure and density support consistent film deposition, preserving layer integrity and enhancing product performance.

Produced under strict quality standards, our 4N silver target undergoes rigorous testing to meet exacting requirements in microelectronics and thin-film technology. Each target is manufactured with advanced refining processes that eliminate impurities and maintain uniform composition, ensuring optimal results in applications such as touchscreens, circuit boards, and solar cells. Rely on our High Purity Silver Sputtering Target (4N) to achieve coating uniformity and reliability in your high-precision projects.

High Purity Silver Sputtering Target (4N) Applications

High Purity Silver Sputtering Target (4N) offers exceptional electrical and thermal conductivity, combined with stable chemical properties. The 4N purity level ensures minimal impurities, making it ideal for advanced applications in multiple industries. Its versatility in thin film deposition processes enables the creation of high-quality coatings with reflectivity and corrosion resistance. This performance profile caters to applications spanning industrial, research, and commercial sectors.

1. Industrial Applications

·        Application 1: Used in semiconductor device manufacturing for creating highly conductive layers with minimal defects.

·        Application 2: Employed in large-scale coating systems, given its thermal stability for components subjected to high temperatures.

2. Research Applications

·        Application 1: Utilised in thin film development for optics and photonics, benefiting from its reflectivity.

·        Application 2: Enables advanced sensor fabrication in laboratory settings, where purity is crucial for accurate measurements.

3. Commercial Applications

·        Application 1: Incorporated into consumer electronics for circuit board metallisation, enhancing device performance.

·        Application 2: Deployed in decorative plating solutions, utilising its lustre and resistance to tarnishing.

High Purity Silver Sputtering Target (4N) Packaging

Each High Purity Silver Sputtering Target (4N) is sealed in vacuum-sealed packaging and buffered with foam to prevent contamination or mechanical damage. The outer casing offers additional protection. Storage in a clean, dry environment helps avoid moisture intrusion, minimising oxidation risks. Anti-contamination measures include sealing under controlled conditions. Customisation is available for target dimensions and labelling, ensuring specific requirements for research and industrial applications are met.

Packaging: Vacuum sealed, Wooden Box, or Customised.

High Purity Silver Sputtering Target (4N) FAQs

Q1: What are the key material properties of High Purity Silver Sputtering Target (4N)?

A1: The High Purity Silver Sputtering Target (4N), featuring a 99.99% minimum purity, exhibits exceptional electrical conductivity, high reflectivity, and minimal surface defects. This target also provides excellent thermal conductivity, consistent grain structure, and minimal impurity-induced contamination. These attributes ensure uniform film deposition, enhance performance in semiconductor and optical applications, and ensure adhesion, resulting in stable and reliable device performance under demanding processing conditions.

Q2: How should this product be handled and stored?

A2: When handling High Purity Silver Sputtering Target (4N), always wear clean gloves and use non-abrasive tools to prevent surface damage or contamination. Store the target in a controlled environment with low humidity and stable temperature, ideally in vacuum-sealed or moisture-proof packaging. Avoid direct contact with bare hands to maintain purity, and apply protective measures to minimise oxidation or particle accumulation during prolonged storage.

Q3: Which quality standards and certifications apply to High Purity Silver Sputtering Target (4N)?

A3: These targets typically comply with ISO 9001 for quality management systems and may also meet ISO 14001 for environmental standards. Independent assays confirm metallic composition and purity, often validated by advanced techniques such as ICP-OES or GD-MS. Manufacturers may issue Certificates of Analysis verifying 99.99% purity, confirming trace elements, and ensuring consistency in thickness and structure, thereby meeting international industrial and research requirements.

Related Information

1. Material Properties and Advantages

High Purity Silver Sputtering Target (4N) stands out for its electrical conductivity, allowing for efficient energy transfer in various applications. This elevated purity grade ensures minimal contamination, reducing the risk of defects in thin-film layers and enhancing the overall integrity of the deposited coatings.

Engineered with reliability in mind, these sputtering targets exhibit excellent thermal conductivity, which helps maintain stable temperatures during deposition processes. Laboratory analyses indicate that their ductile nature not only facilitates manufacturing but also contributes to extended product lifespans in demanding production environments.

2. Applications in Advanced Industries

Diversified across thriving sectors, High Purity Silver Sputtering Target (4N) is a critical component in semiconductors, allowing for precise wiring and contact layers in modern microprocessors. Its low impurity content also makes it highly valued in photovoltaic cells, where conductivity can enhance electron flow efficiency and boost energy output.

Demand for lightweight and reliable materials has further expanded the use of high purity silver targets in aerospace technologies. By integrating these sputtering materials into sensor arrays and communication devices, manufacturers can achieve consistent performance under challenging conditions, paving the way for innovations in this competitive field.