TM9476 Titanium Substrate Ti Substrate Dia. 0.5 inch x 0.5 mm, SSP

Titanium Substrate Ti Substrate Dia. 0.5 inch x 0.5 mm, SSP Description

Titanium Substrate Ti Substrate Dia. 0.5 inch x 0.5 mm, SSP is produced from titanium metal with precise dimensional control and surface uniformity. The substrate’s 0.5 inch diameter and 0.5 mm thickness ensure compatibility with standard crystal processing equipment. Its controlled surface finish minimises interference during epitaxial growth, making it suitable for applications demanding precise material interfaces and minimal substrate-induced variability.

Titanium Substrate Ti Substrate Dia. 0.5 inch x 0.5 mm, SSP Applications

Electronics & Semiconductor Fabrication
- Used as a substrate in semiconductor processing to achieve uniform thin film deposition by leveraging its smooth, finely controlled surface finish.
- Applied as a base in integrated circuit assembly to reduce contamination risks through titanium’s chemical inertness.

Industrial Research & Precision Measurement
- Serves as a platform for material testing in calibration equipment to support accurate measurements by utilising its precise dimensions.
- Frequently used in sensor and instrumentation setups to enhance performance consistency by capitalising on its refined surface characteristics.

Titanium Substrate Ti Substrate Dia. 0.5 inch x 0.5 mm, SSP Packing

The substrate is secured in an anti-static foam-lined container to minimise mechanical damage and dust contamination. It is wrapped in a protective, moisture-resistant covering and stored in a temperature-controlled environment. Packaging emphasises minimal handling and secure transport, with customisation options available for compartmentalisation and labelling to meet specific storage and handling requirements.

Frequently Asked Questions

Q1: How is the dimensional accuracy verified during production?
A1: Dimensional accuracy is maintained through calibrated machining processes and verified using optical microscopy and surface profilometry. These inspection methods confirm that the substrate meets precise diameter and thickness tolerances essential for subsequent crystal processing.

Q2: How do the surface finish parameters impact process compatibility?
A2: The fine surface treatment minimises surface irregularities, which is critical during epitaxial deposition. This controlled finish reduces the potential for film defects and promotes uniform material growth, thereby supporting consistent performance in downstream applications.

Q3: Is it possible to customise the substrate dimensions or surface finish?
A3: Customisation options exist for adjusting substrate thickness or modifying surface finish characteristics. Customers can discuss specific requirements with SAM technical representatives to align the substrate properties with unique processing demands.

Additional Information

Titanium substrates are widely used in research and industrial applications due to titanium’s inherent resistance to corrosion and oxidation. The non-ferrous nature of titanium ensures minimal chemical interaction during high-temperature processes, making it an excellent choice for sensitive material growths and analyses.

Within the realm of crystal substrates, consistent dimensional control and surface uniformity are critical. Advanced measures such as precision machining and detailed surface analysis ensure that titanium substrates meet exacting standards required in fields like semiconductor fabrication and precision instrumentation. This integration of materials science with rigorous process control facilitates high-performance applications in various technological sectors.