TM9477 Titanium Substrate Ti Substrate Dia. 1 inch x 0.5 mm, SSP

Titanium Substrate Ti Substrate Dia. 1 inch x 0.5 mm, SSP Description

Titanium Substrate Ti Substrate Dia. 1 inch x 0.5 mm, SSP is manufactured from refined titanium using controlled processing to achieve a 1-inch diameter and a 0.5 mm thickness. The substrate exhibits a uniform grain structure and low surface roughness, properties that are essential for applications requiring precise film deposition. Its chemical inertness and mechanical stability support subsequent microelectronics and crystal growth processes.

Titanium Substrate Ti Substrate Dia. 1 inch x 0.5 mm, SSP Applications

Electronics
- Used as a base for semiconductor film deposition in integrated circuit fabrication to achieve uniform layer formation by leveraging controlled surface finish.
- Applied as a support layer in sensor devices to facilitate stable electrical contacts by exploiting the substrate’s low surface roughness.

Industrial
- Serves as a substrate in thin-film solar cell assemblies to enable uniform coating and minimal defect propagation by taking advantage of its precise dimensional control.

Titanium Substrate Ti Substrate Dia. 1 inch x 0.5 mm, SSP Packing

Titanium Substrate is packaged in anti-static, inert material wrapping and secured within rigid, foam-lined containers to prevent mechanical damage and contamination. Storage in a dry, low-humidity environment is recommended to avoid oxidation. Custom packaging options, including sealed and labelled pouches, are available to meet specific handling and storage requirements while ensuring minimal exposure to environmental variations during transit.

Frequently Asked Questions

Q1: How is the substrate's surface finish controlled during production?
A1: The production process incorporates electron microscopy and surface profilometry to monitor and adjust polishing steps, ensuring surface roughness remains within target limits, which is vital for subsequent film deposition integrity.

Q2: What precautions should be observed when handling the titanium substrate in a cleanroom setting?
A2: Use specialised gloves and transfer the substrate in anti-static enclosures. Strict cleanroom protocols help minimise contact with particulates, preserving the substrate’s controlled surface properties and dimensional accuracy.

Q3: How does the substrate's dimensional uniformity affect its performance in microelectronic applications?
A3: Consistent diameter and thickness ensure compatibility with standard processing equipment and support reliable film deposition, reducing process variability and the risk of mechanical misalignment during device assembly.

Additional Information

Titanium metal is valued for its low density, chemical inertness, and corrosion resistance, making it suitable for applications requiring stable mechanical properties and minimal thermal expansion. In substrate applications, these characteristics support high-precision processes, ensuring compatibility with advanced thin-film deposition techniques.

The integration of titanium substrates in microelectronic and crystal growth processes benefits from the material’s controlled microstructure and low surface roughness. Understanding these attributes aids in optimising process parameters and improving overall device performance within diverse industrial contexts.