TM9478 Titanium Substrate Ti Substrate 1 inch x 1 inch x 0.5 mm, SSP

Titanium Substrate Ti Substrate 1 inch x 1 inch x 0.5 mm, SSP Description

The Titanium Substrate Ti Substrate 1 inch x 1 inch x 0.5 mm, SSP is manufactured from high-grade titanium with a controlled surface finish. Its precise dimensions facilitate integration with standard semiconductor processing equipment. The chemical inertness of titanium assists in preventing oxidation, while the uniformly flat surface supports consistent deposition and patterning. This substrate is suitable for environments where stable mechanical properties and controlled surface characteristics are essential.

Titanium Substrate Ti Substrate 1 inch x 1 inch x 0.5 mm, SSP Applications

Electronics and Semiconductor
- Used as a substrate in thin film deposition systems to achieve uniform layer growth by leveraging its flatness and chemical inertness.
- Applied as a base in microfabrication processes to obtain predictable patterning owing to its precise dimensional tolerances.

Industrial Processing
- Serves as a support plate in metallurgical procedures to maintain temperature uniformity by utilising its consistent thermal behaviour and minimal warpage.

Laboratory Research
- Utilised as an experimental platform in materials science studies to examine diffusion characteristics by capitalising on its controlled surface properties and stable composition.

Titanium Substrate Ti Substrate 1 inch x 1 inch x 0.5 mm, SSP Packing

Each substrate is packaged individually in an anti-static container with foam inserts and sealed in a polyethylene bag to avoid contamination. The packaging is designed for storage in a clean, dry, and temperature-controlled environment. Additional customisation options such as vacuum-sealed cases and labelled trays are available for specific handling requirements.

Frequently Asked Questions

Q1: How are the dimensional tolerances maintained for this substrate?
A1: The substrate is processed under strict machining parameters with a tolerance control of ±0.01 mm. This precision minimises variation during deposition processes, contributing to stable interlayer interfaces.

Q2: What methods are used to verify the surface finish quality?
A2: The surface finish is assessed using atomic force microscopy (AFM), which accurately measures surface roughness. This verification ensures a uniform, planar surface suitable for high-resolution thin film applications.

Q3: What steps are recommended to prevent contamination of the substrate?
A3: Handling in cleanroom environments and packaging in anti-static, moisture-resistant enclosures minimises contamination. Adhering to these protocols is essential to preserve the substrate's surface integrity during storage and processing.

Additional Information

Titanium substrates are extensively studied for their performance in high-temperature and high-vacuum environments, where chemical inertness and mechanical stability are crucial. Their low reactivity and resistance to oxidation make titanium an optimal choice for applications involving thin film deposition and advanced semiconductor processing.

Recent advancements in surface characterisation have improved the understanding of titanium’s microstructural behaviour under thermal cycling. This research is vital in optimising substrate preparation processes, ensuring that dimensional stability and surface uniformity are maintained throughout various fabrication stages.