TM9479 Titanium Substrate Ti Substrate 10x10x0.5 mm, SSP

Titanium Substrate Ti Substrate 10x10x0.5 mm, SSP Description

Fabricated from high-purity titanium, this substrate measures 10x10x0.5 mm and is processed via the SSP method to achieve a minimised defect density and consistent surface finish. Its uniform thickness and controlled microstructure support compatibility with standard semiconductor and crystallographic processing equipment.

Titanium Substrate Ti Substrate 10x10x0.5 mm, SSP Applications

Electronics
- Used as a support platform in semiconductor devices to achieve uniform thin-film deposition by leveraging its precise dimensional stability.
- Applied as a substrate in microelectronic sensors to facilitate accurate patterning through consistent surface properties.

Industrial
- Used as a base material in sensor fabrication to achieve precise electrode positioning by utilising its controlled surface finish.
- Applied in process control systems where dimensional uniformity aids in reproducible material deposition.

Healthcare
- Serves as a component in bioengineering devices to achieve biocompatible interfaces by utilising titanium’s inert characteristic.
- Frequently used in diagnostic equipment to maintain stable mechanical properties under repeated sterilisation cycles.

Titanium Substrate Ti Substrate 10x10x0.5 mm, SSP Packing

Titanium substrates are individually packaged in antistatic pouches with foam cushioning to minimise mechanical stress during transit. The packaging incorporates a moisture barrier laminate and secure enclosures to prevent contamination. It is recommended to store the substrates in a controlled, low-humidity environment. Custom options such as vacuum-sealed pouches and compartmentalised trays are available upon request.

Frequently Asked Questions

Q1: What testing methods are used to verify substrate uniformity?
A1: SAM employs X-ray diffraction and surface profilometry to assess crystalline structure and thickness consistency, ensuring each substrate meets stringent uniformity requirements prior to shipment.

Q2: How does the SSP process affect the titanium substrate?
A2: The SSP process optimises the substrate’s microstructure and minimises surface defects, resulting in consistent dimensional control and an even surface finish for enhanced compatibility with subsequent processing steps.

Q3: What storage conditions are recommended for these substrates?
A3: Substrates should be stored in a temperature-controlled, low-humidity environment while retained in their antistatic, protective packaging to prevent oxidation and contamination before use.

Additional Information

Titanium substrates are widely utilised in fields requiring precise and uniform material properties. The inherent chemical inertness of titanium and its capacity to withstand high temperatures make it suitable for applications in semiconductor fabrication and advanced materials research. Detailed characterisation of its surface conditions is crucial to ensure proper interface behaviour during device integration.

The engineering of titanium substrates focuses on achieving reproducible material characteristics. Advanced analytical techniques such as X-ray diffraction and profilometry contribute to a deeper understanding of the substrate’s microstructural properties. This approach supports subsequent processing steps and promotes consistent material performance across various industrial and research applications.