TM9480 Titanium Substrate Ti Substrate 10x5x0.5 mm, SSP

Titanium Substrate Ti Substrate 10x5x0.5 mm, SSP Description

The Titanium Substrate Ti Substrate 10x5x0.5 mm, SSP comprises titanium metal formed to exact dimensions of 10 mm x 5 mm x 0.5 mm. The defined thickness ensures compatibility with standard processing equipment while its chemically inert nature minimises unwanted reactions. Surface characterisation methods, such as profilometry, confirm a flatness conducive to subsequent film deposition and other material integrations, meeting the technical demands of precise experimental setups.

Titanium Substrate Ti Substrate 10x5x0.5 mm, SSP Applications

1.       Electronics
- Used as a substrate for thin film deposition on sensor devices to achieve stable layer adhesion by leveraging its chemically inert titanium composition.
- Applied as a base for microelectronic components in integrated circuit fabrication to control interfacial reactions by leveraging its dimensional stability.

2.       Industrial
- Employed as a structural support in high-temperature processing equipment to regulate thermal expansion by leveraging its controlled thickness and flat surface finish.
- Utilised as a backing plate in coating processes to maintain consistency during thermal treatments by leveraging its uniform material properties.

Titanium Substrate Ti Substrate 10x5x0.5 mm, SSP Packing

The titanium substrate is secured in an anti-static, cleanroom-grade polyethylene pouch and placed within a foam-lined container to mitigate mechanical shocks. The packaging is designed for storage in a dust-free, temperature-controlled environment with recommendations on minimal handling to reduce contamination risks. Custom packaging options, including individualised compartmentalisation and specific labelling, are available upon request.

Frequently Asked Questions

Q1: How does the surface finish of the substrate impact subsequent film deposition processes?
A1: A flat and uniform surface minimises nucleation variability and promotes even film growth during deposition. Profilometry assessments confirm the surface integrity required for reliable layer adhesion in semiconductor and sensor applications.

Q2: What measures ensure the dimensional accuracy of the titanium substrate?
A2: The substrate undergoes controlled atmospheric processing and is measured using calibrated optical microscopy and profilometry. These methods ensure that the 10x5x0.5 mm dimensions adhere strictly to the required tolerances for integration in precision systems.

Q3: Can this titanium substrate withstand high-temperature processing environments?
A3: Yes, titanium’s inherent thermal stability and the substrate’s verified dimensional stability allow it to perform effectively under high-temperature conditions, ensuring minimal thermal expansion during processing steps.

Additional Information

Titanium substrates are integral in various research and industrial settings due to their chemical inertness and structural stability. In material science, titanium metal is often used as a base for depositing thin films, where its stable oxidation properties provide a consistent interface for experimental material integrations.

Understanding the behaviour of titanium in different environmental conditions aids in optimising its use in applications ranging from semiconductor processing to industrial coating systems. The scientific community continues to explore its potential to improve device performance through controlled material interactions and precision fabrication techniques.