Description of Copper Nitride Powder
Copper nitride is a covalently bound metal nitride. Given its structural characteristics, CuN is employed in the fields of optical data storage and integrated high-speed circuits. CuN is a non-toxic and stable raw material that replaces toxic tellurium-based materials used as an optical recording medium. In HCl, CuN can be etched more easily than copper. When a copper metal wire is deposited on a silicon wafer, the copper nitride film is used as a mask layer, thereby achieving a higher signal speed than that obtained with the aluminium metal wire used in the fabrication of integrated circuits.
Specifications of Copper Nitride Powder
Synonyms
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Tricopper nitride; Nitrilotricopper(I), etc.
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CAS No.
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1308-80-1
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Molecular Formula
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Cu3N
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Molecular Weight
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204.64
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Melting Point
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300℃
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Density
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5,84 g/cm3
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Crystal Form
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cubic crystals
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Solubility
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Decomposes in H2O
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Applications of Copper Nitride Powder
- Used as a neutron poison in nuclear reactors
- Precursor for Gd compounds
- Utilised as a catalyst
- Employed as an optical recording material
Packaging of Copper Nitride Powder
- 1 kg/bag
- 25 kg/barrel
All packaging materials are suitable for air, sea and road freight. Care is taken to ensure that no damage occurs during storage or transport.