Gold-Tin Alloy Spheres (Au80Sn20) Description
The spheres exhibit a sphericity of >99% (diameter tolerance ±10 μm) and a surface roughness of <0.1 μm Ra. The eutectic composition ensures uniform reflow with minimal intermetallic growth. The high thermal conductivity (57 W/m-K) and the coefficient of thermal expansion (14 ppm/°C) are tailored for silicon substrates, thereby reducing thermal stress. An oxygen content of <100 ppm prevents oxidation during the reflow process. Applications include 5G RF modules, radiation-hardened FPGAs, and high-brightness LED arrays.
Gold-Tin Alloy Spheres (Au80Sn20) Applications
-Gold-Tin alloy spheres (Au80Sn20) are commonly used in highly reliable applications, such as in microelectronics, the assembly of optoelectronic devices, the mounting of laser diodes, and hermetic seals, where exceptional thermal conductivity, mechanical strength, and a stable eutectic bond are critical.
Gold-Tin Alloy Spheres (Au80Sn20) Packaging
Our products are packaged in custom boxes of various sizes based on material dimensions. Small items are securely packed in PP boxes, while larger items are placed in custom wooden crates. We observe strict adherence to packaging specifications and the use of appropriate cushioning materials to ensure optimal protection during transport.
Packaging: Box, Wooden crate, or custom.
Please see the packaging details for your reference.
Manufacturing Process
1)Testing Procedures
(1)Chemical composition analysis - Verified using techniques such as GDMS or XRF to ensure compliance with purity requirements.
(2)Mechanical properties testing - Includes tensile strength, yield strength, and elongation tests to assess material performance.
(3)Dimensional testing - Measures thickness, width, and length to ensure compliance with specified tolerances.
(4)Surface quality inspection - Checks for defects such as scratches, cracks, or inclusions through visual and ultrasonic inspection.
(5)Hardness testing - Determines material hardness to confirm uniformity and mechanical reliability.
For detailed information, please refer to the SAM Testing Procedures.
Frequently Asked Questions about Gold-Tin Alloy Spheres (Au80Sn20)
Q1. What are the main applications of Au80Sn20 solder spheres?
They are commonly used in microelectronics, optoelectronics, packaging of laser diodes, RF components, and hermetic sealing where high thermal conductivity and mechanical strength are required.
Q2. What is the melting point of Au80Sn20?
The eutectic melting point is approximately 280 °C, providing a sharp phase transition for clean and reliable soldering.
Q3. What are the benefits of using Au80Sn20 solder spheres?
They offer exceptional thermal and electrical conductivity, corrosion resistance, strong mechanical connections, and compatibility with sensitive or high-temperature components.
Performance Comparison Table with Competing Products
|
Property
|
Au80Sn20 Sphere
|
SAC305 Sphere
|
Sn63Pb37 Sphere
|
|
Melting Point (°C)
|
280
|
217-220
|
183
|
|
Shear Strength (MPa)
|
>60
|
35
|
25
|
|
Thermal Cycles (-55-150°C)
|
>1,000
|
500
|
300
|
Related Information
1.Common Preparation Methods
Gold-Tin alloy spheres (Au80Sn20) are typically produced using a precision melting and atomization process. Initially, high-purity gold and tin are melted together in the eutectic ratio (80 wt-% Au, 20 wt-% Sn) under an inert or vacuum atmosphere to prevent oxidation. The molten alloy is then rapidly solidified into spherical particles using a gas atomization or droplet formation technique. For high-precision applications, additional size classification, screening, and surface treatment (e.g., oxidant removal or passivation) can be performed to ensure uniformity, cleanliness, and excellent bonding performance.
Write for Us
Converters & Calculators
