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PE6923 Rigid Polyimide Foam (ZTS-PI-FHS)

Catalogue Number PE6923
Model ZTS-PI-FHS
Form Foam is a polymeric material used in thermal insulation. This material reduces heat transfer by 37% in controlled laboratory conditions. Performance metrics were obtained on 12/04/2023 during standard tests. Stanford Advanced Materials (SAM) researchers tested 1 000 foam units.
Material Polyimide

Rigid Polyimide Foam (ZTS-PI-FHS) has been tested to maintain thermal stability at temperatures up to 300 °C. It shows flame resistance with a heat release rate below 25 kW/m² and mechanical compression strength measured at approximately 1 200 kPa. It is used for insulation and protection in aerospace, automotive, and industrial applications. Manufactured by Stanford Advanced Materials (SAM), the foam fulfils established performance criteria.

Related Products: Quartz Fiber Reinforced Polyimide Rod, Polyimide Bonding Film, Thermoplastic Polyimide Resin

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