Discontinued (Discontinued) ST0170 Lead Zirconium Titanate (PbZr0.52Ti0.48O3) Sputtering Target

Lead Zirconate Titanate (PbZr0.52Ti0.48O3) Sputtering Target Description

The sputtering target made from Lead Zirconate Titanate (PbZr0.52Ti0.48O3) has been developed for precision applications in sputter processes. This target meets the demanding requirements of modern electronics and advanced material coatings, providing exceptional purity and performance. Its high-quality attributes ensure consistency and reliability across various industrial high-tech applications.

Lead Zirconate Titanate (PbZr0.52Ti0.48O3) Sputtering Target Applications

- Electronics Manufacturing: Ideal for creating thin films used in modern microelectronics.
- Surface Coating: Delivers uniform and consistent layers in coating applications.
- Advanced Materials Research: Supports development and testing in materials science laboratories.
- Custom Industrial Processes: Available in tailored shapes to meet specific process requirements.

Lead Zirconate Titanate (PbZr0.52Ti0.48O3) Sputtering Target Packaging

Our sputtering targets are carefully packaged under controlled conditions to maintain their performance quality. Each target is vacuum-sealed and clearly labelled. Custom packaging options are also available according to customer needs.

Frequently Asked Questions

Q: What types of sputtering methods can be used with this target?
A: This target supports RF, RF-R, and DC sputtering methods.

Q: How does the high purity level (≥99%) affect sputter process performance?
A: The high purity level ensures minimal contamination, leading to consistent film quality and reliable performance in critical applications.

Q: Can the shapes and sizes of the sputtering targets be customised?
A: Yes, in addition to standard disc shapes, custom options are available to meet specific production requirements.

Q: Which industries typically use Lead Zirconate Titanate sputtering targets?
A: Industries such as electronics, surface coating, and modern materials research frequently utilise these sputtering targets.

Q: What significance does the density of ~8.0 g/cm³ have for the target's performance?
A: The specified density is crucial for achieving the desired structural integrity and performance during the sputtering process, ensuring uniform deposition.