ST0181 Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Target

Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Target Description

The Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Target is engineered for advanced industrial applications requiring high durability and precision. Manufactured with a purity of ≥99%, this target delivers reliable performance for thin film deposition via RF, RF-R, and DC sputtering methods. Its customizable sizes and versatile bonding options, including indium and elastomer, make it a perfect choice for research and production environments. The material’s robust physical properties ensure optimal operation under rigorous processing conditions.

Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Target Applications

· Thin Film Deposition: Ideal for fabricating high-quality coatings in semiconductor and microelectronic industries.
· Surface Engineering: Suitable for creating precise and uniform layers for optical, magnetic, and protective coatings.
· Material Research: Used in advanced materials research for exploring novel properties and functional applications.
· Industrial Coatings: Applicable in the production of wear-resistant and corrosion-resistant coatings for various industrial components.

Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Target Packing

Our sputtering targets are packaged with the utmost care to maintain their high purity and structural integrity. Each unit is securely wrapped and cushioned to prevent any damage during transit. Custom packaging solutions are also available based on client requirements.

Frequently Asked Questions

Q: What are sputtering targets used for?
A: Sputtering targets are used in physical vapor deposition (PVD) processes to create thin films and coatings on various substrates, essential for semiconductor devices, optical coatings, and other advanced material applications.

Q: How does the sputtering process work with this target?
A: In the sputtering process, ions bombard the target material, causing atoms to be ejected and deposited onto a substrate, forming a thin, uniform film. The target is compatible with RF, RF-R, and DC sputtering methods.

Q: Why is high purity (≥99%) important in sputtering targets?
A: High purity ensures minimal contamination, leading to better film quality, improved adhesion, and enhanced performance of the deposited layers, which is critical for advanced microelectronic applications.

Q: What should I consider when ordering a customized sputtering target?
A: When ordering customized targets, consider the required dimensions, bonding type (Indium, Elastomer), and compatibility with your sputtering equipment to ensure optimal deposition performance.

Q: How should the sputtering target be stored prior to use?
A: It is recommended to store sputtering targets in a clean, dry environment with controlled temperature and humidity to maintain their integrity and prevent contamination before use.