ST0209 Boron Nitride (BN) Sputtering Target

Boron Nitride (BN) Sputtering Target Description

Our Boron Nitride (BN) Sputtering Target is produced using hot press sintering followed by precision machining to achieve high density (>1.9 g/cm³) and a fine, uniform grain structure. This manufacturing approach is critical for BN due to its anisotropic hexagonal crystal structure; proper densification and grain orientation control minimise particle generation during sputtering and ensure consistent erosion across the target surface.

Boron nitride offers a distinctive combination of properties—high thermal conductivity (~30 W/m·K), excellent electrical insulation, and exceptional thermal stability (sublimes at ~2,973°C)—making it a preferred material for demanding thin film applications. Each BN target is suitable for RF and RF-Reactive sputtering systems, delivering repeatable film properties for insulating layers, buffer layers, and protective coatings.

All targets are cleaned and vacuum-sealed prior to shipment to prevent contamination and maintain surface integrity.

Boron Nitride (BN) Sputtering Target Specification

Note: Custom configurations (purity, dimensions, bonding) and material analysis reports are available upon request.

Boron Nitride (BN) Sputtering Target Applications

Boron Nitride is a unique ceramic with high thermal conductivity but excellent electrical insulation—that combination is hard to find. Common applications include:

• Semiconductor Manufacturing: Used as insulating layers, passivation films, and diffusion barriers in IC fabrication

• Microelectronics & MEMS: Dielectric layers, buffer layers for GaN devices, and protective coatings for sensors

• Optical Coatings: Transparent protective layers for infrared optics and laser components

• High-Temperature Coatings: BN maintains stability at extreme temperatures, ideal for protective coatings in aerospace and industrial applications

• 2D Material Research: h-BN is widely used as a substrate and dielectric layer for graphene and other 2D materials research

• Thermal Management: Despite being electrically insulating, BN has high thermal conductivity—used in thermal interface materials and heat spreaders

Boron Nitride (BN) Sputtering Target Packing

BN is soft compared to metal targets—it can chip or crack if handled roughly. We take that into account when packing. Each target is cleaned, inspected, then vacuum-sealed in moisture-barrier packaging. For custom shapes or larger orders, we use custom foam inserts to keep the target stable during transit. If you have specific packaging requirements (cleanroom certification, etc.), just let us know and we'll accommodate.