ST0215 Silicon Nitride (Si3N4) Sputtering Target

Silicon Nitride (Si3N4) Sputtering Target Description

Our Silicon Nitride (Si3N4) Sputtering Target is produced using hot press sintering followed by precision machining to achieve a fine-grain structure (2-5 μm) and >99% relative density. This manufacturing approach minimises particle generation during sputtering and ensures consistent erosion across the target surface.

Silicon nitride's unique combination of properties—high hardness, excellent thermal stability, and outstanding electrical insulation—makes it the preferred material for demanding thin film applications. Each Si3N4 sputtering target is polished to a surface finish of <0.5 μm Ra and undergoes rigorous quality inspection before being vacuum-sealed in cleanroom conditions to prevent contamination.

Designed primarily for RF and RF-Reactive sputtering systems, this ceramic target delivers repeatable film properties run after run, whether used in research environments or high-volume production.

Silicon Nitride (Si3N4) Sputtering Target Specification

Silicon Nitride (Si3N4) Sputtering Target Applications

Silicon Nitride sputtering targets are critical in depositing hard, insulating, and protective thin films for:

• Semiconductor Manufacturing: Essential for passivation layers on integrated circuits (ICs) to protect against moisture, corrosion, and ionic contamination

• Microelectronics & MEMS: Used as gate dielectrics and insulating layers in sensors and micro-electromechanical systems

• Optical Coatings: Deposits durable, hard films for anti-reflective coatings, protective layers on lenses, and laser components

• Diffusion Barriers: Creates effective barriers to prevent interdiffusion between metal and semiconductor layers

• Advanced Tribological Coatings: Provides wear and corrosion resistance for precision engineering components

• Thin Film Research: Frequently utilised in material science laboratories for process development and characterisation

Silicon Nitride (Si3N4) Sputtering Target Packing

Our Silicon Nitride Sputtering Targets are manufactured to precise specifications and carefully packaged to maintain their high surface quality and integrity. Each target undergoes cleaning in a Class 100 cleanroom environment before being vacuum-sealed in moisture-barrier packaging to guard against contamination and oxidation during storage and transit. Custom packaging solutions are available to meet specific customer requirements, ensuring each target arrives in optimal condition for immediate use.