ST0216 Tantalum Nitride (TaN) Sputtering Target

Tantalum Nitride (TaN) Sputtering Target Description

The Tantalum Nitride (TaN) Sputtering Target is engineered for high-performance sputtering processes in advanced industrial applications. Manufactured with a purity of ≥99% and precision design, this target ensures consistent deposition and high-quality thin films even under demanding operational conditions. Its compatibility with both RF and RF-R sputtering methods makes it an ideal choice for semiconductor fabrication, surface engineering, and advanced research applications.

Tantalum Nitride (TaN) Sputtering Target Applications

· Semiconductor Fabrication: Ideal for depositing high-quality metal nitride films in integrated circuits and display technologies.
· Thin Film Deposition: Used in the production of protective and functional coatings for optical, electronic, and mechanical applications.
· Advanced Research: Provides reliable performance in experimental setups requiring high purity sputtering materials for novel applications.
· Surface Engineering: Enhances wear resistance and thermal stability in components through precise thin film application.

Tantalum Nitride (TaN) Sputtering Target Packing

Each Tantalum Nitride (TaN) Sputtering Target is carefully packaged in a protective, vacuum-sealed container to preserve its integrity during storage and transportation. Custom packaging options are available to meet specific customer requirements.

Frequently Asked Questions

Q: What are the common applications of Tantalum Nitride (TaN) Sputtering Targets?
A: They are used for depositing high-quality thin films in semiconductor devices, displays, integrated circuits, and various advanced coating applications.

Q: Which sputtering methods can be used with this target?
A: This target is compatible with both RF and RF-R sputtering processes, providing versatility for different deposition techniques.

Q: How does the high purity (≥99%) affect sputtering performance?
A: High purity minimizes contamination during the sputtering process, resulting in superior film quality, consistent electrical properties, and enhanced overall performance.

Q: Are custom-made shapes available for this sputtering target?
A: Yes, besides standard discs, the target can be manufactured in custom shapes to meet specific application requirements.

Q: What types of bonding are incorporated in this product?
A: The product utilizes Indium and Elastomer bonds to ensure secure attachment of the target material and efficient heat dissipation during operation.