ST0224 Iron Carbide (Fe3C) Sputtering Target

Iron Carbide (Fe3C) Sputtering Target Description

Iron Carbide (Fe3C) Sputtering Target is engineered for optimal performance in various sputtering processes utilized in microelectronics, thin film deposition, and surface coating applications. Manufactured with a purity of ≥99%, this target offers exceptional uniformity and durability during sputtering deposition. The design allows for customization in size and shape to meet specific industry requirements. Furthermore, its high melting point (~1227℃) and density (~7.7 g/cm³) provide superior thermal stability and mechanical integrity, ensuring consistent and reliable performance in precision applications.

Iron Carbide (Fe3C) Sputtering Target Applications

· Thin Film Deposition: Ideal for fabricating high-quality films in semiconductor devices.
· Microelectronic Components: Used in the manufacturing of specialized microstructures in electronics.
· Protective Coatings: Deposited as functional coatings on various industrial tools and surfaces.
· Research and Development: Beneficial for materials science experiments and innovative technology exploration.
· Surface Engineering: Employed in industrial processes requiring durable and stable coating layers for enhanced performance.

Iron Carbide (Fe3C) Sputtering Target Packing

Our Iron Carbide Sputtering Target is meticulously packaged to preserve its high purity and performance characteristics. It is commonly delivered in protective, anti-corrosive containers and, if required, vacuum-sealed to ensure integrity during storage and transportation. Packaging options can be customized to meet your specific logistics and handling needs.

Frequently Asked Questions

Q: What industries commonly use Iron Carbide sputtering targets?
A: They are widely used in semiconductor fabrication, microelectronics, and advanced coatings across various industrial applications.

Q: What is the significance of having a purity of ≥99% in this sputtering target?
A: High purity is essential for consistent sputtering performance, minimizing impurities that could adversely affect film quality and deposition efficiency.

Q: Are the shapes of the sputtering targets customizable?
A: Yes, our targets are available as standard discs or can be custom-made to meet unique design specifications and dimensions.

Q: How does the melting point of ~1227℃ benefit the sputtering process?
A: A high melting point ensures that the target maintains its structural and chemical integrity under high thermal loads during sputtering, leading to more stable and consistent deposition.

Q: Why is the density of ~7.7 g/cm³ important in sputtering applications?
A: The density plays a crucial role in determining the sputtering yield and deposition efficiency, contributing to a more predictable and controlled deposition process.