ST0227 Silicon Carbide (SiC) Sputtering Target

Silicon Carbide (SiC) Sputtering Target Description

The sputtering target made from Silicon Carbide (SiC) has been developed for the precision deposition of thin films in advanced industrial applications. This target is produced using state-of-the-art methods and features exceptional thermal stability, high chemical inertness, and consistent performance under RF plasma conditions. Its high purity and customizable shapes make it ideal for demanding deposition processes where reliability and uniformity are critical.

Silicon Carbide (SiC) Sputtering Target Applications

- Semiconductor fabrication: For the deposition of protective and functional SiC layers in microelectronic devices.
- Thin film coatings: For the deposition of durable and high-performance coatings for optics and electronics.
- MEMS components: Suitable for the manufacture of micro-electromechanical systems that require stable and robust thin films.
- Research and development: Utilised in experimental setups for the development of next-generation materials and electronic components.

Silicon Carbide (SiC) Sputtering Target Packing

Our Silicon Carbide sputtering targets are packaged in hermetically sealed, contamination-free containers to maintain their pristine condition. Custom packaging options are available to meet specific order sizes and logistical requirements.

Frequently Asked Questions

Q: In which industries is the Silicon Carbide sputtering target primarily used?
A: It is frequently used in semiconductor fabrication, thin film coating processes, MEMS device development, and research and development applications.

Q: For which sputtering process is this target designed?
A: The target is specifically designed for RF sputtering processes, ensuring uniform and consistent deposition.

Q: Why is the high melting point of ~2730℃ important?
A: The high melting point ensures that the target can withstand intense thermal environments during sputtering and remains operationally stable even under extreme conditions.

Q: How customizable are the shapes of the sputtering targets?
A: The targets can be manufactured as standard discs or in custom shapes to fulfil specific device or application requirements.

Q: What quality standards ensure the performance of these targets?
A: Each target is produced with a purity of ≥99% and is subjected to strict quality control measures, ensuring reliable performance and consistency for advanced industrial applications.