ST0239 Chromium Fluoride (CrF3) Sputtering Target

Chromium Fluoride (CrF3) Sputtering Target Description

The Chromium Fluoride (CrF3) Sputtering Target is a high-performance material engineered for precise thin film deposition applications. Manufactured with state-of-the-art processes, it offers exceptional purity (≥99%) and uniform properties, making it suitable for advanced industrial processes. The target is designed to deliver consistent performance in sputtering systems and is ideal for research as well as production environments. Its high melting point and density optimize it for demanding applications, ensuring durability and effectiveness in various coating and deposition technologies.

Chromium Fluoride (CrF3) Sputtering Target Applications

· Semiconductor Manufacturing: Ideal for deposition processes in microelectronics.
· Optical Coatings: Used for producing precision optical coatings with excellent uniformity.
· Plasma Etching and Deposition: Enhances performance in plasma-based sputtering systems.
· Research and Development: Suitable for experimental setups in advanced material studies.
· Specialized Coatings: Applied in various industrial tools and components to achieve high-quality thin films.

Chromium Fluoride (CrF3) Sputtering Target Packing

The Chromium Fluoride Sputtering Target is packaged with utmost care to preserve its purity and structural integrity. Options include vacuum-sealed packaging for smaller quantities or customized packaging solutions to meet specific customer requirements. Each package is clearly labeled with product details to ensure seamless integration into your manufacturing process.

Frequently Asked Questions

Q: What are the primary applications of the Chromium Fluoride (CrF3) Sputtering Target?
A: It is primarily used in semiconductor manufacturing, optical coating deposition, plasma etching, and research applications where high purity and consistent sputtering performance are required.

Q: How does the high purity (≥99%) of CrF₃ impact performance?
A: The high purity ensures consistent sputtering behavior, minimized contamination, and improved thin film uniformity, which are critical for high-performance coatings and electronic applications.

Q: Can the size and shape of the target be customized?
A: Yes, the target is available in discs or custom-made shapes, allowing for tailored solutions to fit specific sputtering system requirements.

Q: What factors should be considered when integrating this target into a sputtering process?
A: Considerations include compatibility with deposition equipment, thermal management due to the high melting point, and ensuring proper handling to maintain its purity and structural integrity.

Q: What storage conditions are recommended for maintaining the target’s quality?
A: It is recommended to store the target in a dry, temperature-controlled environment away from moisture and contaminants, ideally in its original vacuum-sealed packaging until use.