ST0267 Tantalum Silicide (TaSi2) Sputtering Target

Tantalum Silicide (TaSi2) Sputtering Target Description

The Tantalum Silicide (TaSi2) Sputtering Target is produced with a purity of ≥99%, making it an ideal candidate for precision applications in semiconductor and advanced electronic devices. Its optimized physical properties, such as a melting point of 2200℃ and a density of 8.5 g/cm³, ensure reliable performance and high stability during sputtering processes performed under RF, RF-R, and DC conditions. Engineered for both standard disc forms and custom-made designs, this product fulfills diverse industrial requirements by delivering uniform, high-quality thin films with excellent adhesion and durability.

Tantalum Silicide (TaSi2) Sputtering Target Applications

· Semiconductor Fabrication: Ideal for creating precise thin films used in microelectronic components.
· Surface Coatings: Employed in the deposition of wear-resistant and conductive layers on various substrates.
· Advanced Electronics: Used in the production of high-performance circuits and sensors that require stable and conductive films.
· Research and Development: Suitable for experimental setups in material science and nanotechnology where controlled sputtering conditions are essential.

Tantalum Silicide (TaSi2) Sputtering Target Packing

Our Tantalum Silicide Sputtering Targets are meticulously packaged to maintain their pristine condition during storage and shipment.
Packaging options include vacuum-sealed pouches and custom packaging solutions tailored to the product size, such as 5kg per bag or 25kg per drum, ensuring the material's integrity throughout its lifecycle.

Frequently Asked Questions

Q: What properties make Tantalum Silicide ideal for sputtering applications?
A: Tantalum Silicide offers exceptional thermal stability and high electrical conductivity, ensuring reliable thin film deposition and resistance to degradation during the sputtering process.

Q: Which sputtering methods are compatible with this target?
A: The target is designed for RF, RF-R, and DC sputtering techniques, making it versatile for a wide range of industrial processes.

Q: Can the target be customized for specific device requirements?
A: Yes, the Tantalum Silicide Sputtering Target is available in standard disc shapes or can be custom-made to suit specific application needs.

Q: What industries benefit the most from using Tantalum Silicide Sputtering Targets?
A: Industries such as semiconductor manufacturing, advanced electronics, and surface coating technologies greatly benefit from the enhanced performance and durability of this material.

Q: How is the quality and consistency of the sputtering target ensured?
A: Our production process involves rigorous quality control measures and advanced atomization techniques, ensuring each batch meets the high standards required for precision industrial applications.