Discontinued (Discontinued) ST0511 Tungsten Titanium (W/Ti) Sputtering Target

Tungsten Titanium (W/Ti) Sputtering Target Description

The Tungsten-Titanium (W/Ti) Sputtering Target is a high-performance material designed for advanced thin film deposition applications. Manufactured under strict quality controls that ensure purity of ≥99%, this target delivers consistent performance even under the demanding conditions of semiconductor and optical coating processes. It has been developed using innovative bonding techniques involving Indium and Elastomer, guaranteeing secure and reliable attachment during the sputtering process, thereby improving layer uniformity and device performance.

Tungsten Titanium (W/Ti) Sputtering Target Applications

- Thin film deposition: Ideal for producing high-quality thin films in microelectronics and semiconductor device fabrication.
- Optical coatings: Suitable for depositing reflective and anti-reflective layers for modern optical systems.
- Research and development: Provides reliable performance for experimental studies and the development of new materials.
- Industrial manufacturing: Applicable for various industrial applications requiring precise deposition techniques.

Tungsten Titanium (W/Ti) Sputtering Target Packing

Our Tungsten-Titanium sputter targets are packaged carefully to ensure optimal quality and integrity during storage and transport. They are available in disc form or as custom solutions tailored to specific customer requirements.

Frequently Asked Questions

Q: What are the typical applications of Tungsten-Titanium sputter targets?
A: They are primarily used in thin film deposition processes for microelectronic devices, optical coatings, and modern semiconductor manufacturing.

Q: How is the purity of ≥99% maintained during production?
A: Our manufacturing process includes stringent quality controls and advanced synthesis techniques to ensure that each target consistently meets high purity standards.

Q: Can the shapes of the targets be customised?
A: Yes, in addition to standard disc forms, our Tungsten-Titanium sputter targets can also be custom-made to meet specific application requirements.

Q: What type of bonding is used for these sputter targets?
A: The sputter targets utilise bonding techniques that incorporate Indium and Elastomer to ensure a secure and reliable connection with the sputter apparatus.

Q: Are there special storage requirements to maintain the performance of the targets?
A: To maintain quality, it is recommended to store the targets in a clean, dry environment free from contaminants that could impair their performance.