ST0519 Tungsten Boride (WB) Sputtering Target

Tungsten Boride (WB) Sputtering Target Description

The Tungsten Boride (WB) Sputtering Target is a specialised material designed for advanced sputtering applications. Manufactured to the highest purity standards (≥99%), this product provides exceptional performance for thin film deposition in critical industrial processes. Its composition ensures durability and stability in challenging environments. Customisable discs and special shapes facilitate precise integration into various sputter systems, making it an optimal choice for semiconductor, microelectronics, and wear-resistant coating applications.

Tungsten Boride (WB) Sputtering Target Applications

- Thin film deposition: Ideal for producing high-quality layers in microelectronics and semiconductor devices.
- Microelectronic packaging: Enhances performance in environments requiring precise coating applications.
- Wear-resistant coatings: Provides a durable surface for industrial components and tools.
- Research and development: Utilised for advanced material studies and prototyping applications.

Tungsten Boride (WB) Sputtering Target Packing

Our Tungsten Boride sputtering targets are securely packaged to maintain their pristine condition during storage and transport. Options include:
- Vacuum-sealed packaging for standard targets
- Custom packaging solutions are available upon request to meet specific application requirements.

Frequently Asked Questions

Q: In which industries are Tungsten Boride sputtering targets commonly used?
A: Tungsten Boride sputtering targets are frequently utilised in the semiconductor and microelectronics industries due to their excellent durability and film deposition capabilities.

Q: How does a purity level of ≥99% affect target performance?
A: The high purity level ensures minimal contamination during sputtering, resulting in consistent, high-quality thin film deposition.

Q: Can the shapes of the sputtering target be customised?
A: Yes, the product is available in standard disc form or can be custom manufactured to meet specific system requirements.

Q: What factors should be considered when selecting a sputtering target?
A: It is important to consider the material composition, purity level, physical dimensions, and compatibility with the sputter system to ensure optimal performance.

Q: How is the Tungsten Boride sputtering target packaged for shipping?
A: The targets are vacuum-sealed or packaged according to customer specifications to maintain product integrity during storage and transport.