ST0928 Neodymium Fluoride Sputtering Target, NdF3

Neodymium Fluoride Sputtering Target Description

The Neodymium fluoride sputtering target, NdF3, is designed for precision and reliability in high-tech applications. The target is manufactured with the aim of achieving a purity of ≥99%. It is available in disc form or as custom-made designs to meet specific production requirements. Its excellent thermal stability, evidenced by a melting point of 1 410 °C, and its high density of 7.0 g/cm³ make it ideal for advanced sputtering processes. The addition of indium as a binder further enhances performance by ensuring uniform material deposition and process stability during sputtering.

Applications for Neodymium Fluoride Sputtering Targets

- Semiconductor manufacturing: Essential for the deposition of thin films in microelectronics.
- Optical coatings: Used for the production of highly precise optical components.
- Advanced materials research: Suitable for experimental sputtering in research and development laboratories.
- Thin-film deposition: Ensures uniform deposition for sensors and the manufacturing of innovative devices.

Neodymium Fluoride Sputtering Target Packaging

Each target is carefully packaged to ensure minimal contamination and maximum quality preservation. Custom packaging options are available to meet the specific requirements of research institutions and industrial applications.

Frequently Asked Questions

Q: What is the primary application of the neodymium fluoride sputtering target?
A: It is primarily used in sputtering processes for semiconductor manufacturing, thin-film deposition, and optical coatings.

Q: How is the purity of the NdF₃ target ensured?
A: Our targets are manufactured under stringent quality control protocols that guarantee a purity level of ≥99%.

Q: Can I order a custom target shape?
A: Yes, we offer custom shapes that conform to specific manufacturing requirements.

Q: What are the storage recommendations for these sputtering targets?
A: It is recommended to store them in a controlled, dry environment to avoid contamination and damage.

Q: How does the indium binding affect the sputtering process?
A: The indium binding improves adhesion and ensures uniform material deposition during the sputtering process.