Discontinued (Discontinued) ST0970 Germanium Disulphide Sputtering Target, GeS2

Germanium Disulphide Sputtering Target Description

The Germanium Disulphide Sputtering Target, GeS2, has been meticulously developed for advanced industrial and research applications. With a composition of GeS₂ and a purity of ≥99%, this sputtering target is ideal for precision coatings and semiconductor processes. Its physical properties, including a melting point of 800 °C and a density of 2.94 g/cm³, ensure reliable performance under demanding conditions. The target is available in standard disc forms or can be customised to meet specific application requirements.

Germanium Disulphide Sputtering Target Applications

- Semiconductor processing: Ideal for high-precision sputtering applications in microelectronics and for integrated circuits.
- Vacuum coating: For the deposition of thin films for optical and electronic components.
- Research and development: Provides a reliable material source for experimental setups in materials science and engineering.
- Surface engineering: Enhances surface properties such as conductivity and chemical resistance in advanced manufacturing techniques.

Germanium Disulphide Sputtering Target Packing

Our Germanium Disulphide Sputtering Targets are carefully packaged to ensure product integrity during storage and transportation. Standard packaging includes vacuum-sealed containers for smaller sizes, while larger orders can be custom packaged to ensure optimal protection and handling.

Frequently Asked Questions

Q: What is the significance of the product's purity?
A: A purity of ≥99% ensures that the Germanium Disulphide Sputtering Target operates reliably and meets the stringent requirements for semiconductor and coating applications.

Q: In what forms is the target available?
A: The target is available in standard disc forms, with customised options available to meet specific application needs.

Q: How does the melting point affect its usage?
A: With a melting point of 800 °C, the target maintains its structural integrity and performance under high-temperature conditions typically experienced during sputtering processes.

Q: What role does the indium bond play in this product?
A: The indium bond facilitates effective heat conduction and ensures a strong, uniform connection between the target material and its substrate, which is critical for consistent sputtering performance.

Q: Can the target be customised in size?
A: Yes, the available sizes are tailored to the specific requirements of various sputtering systems and applications.