Description:
Lead (Pb) evaporation materials are used in thin‐film deposition processes. They provide controlled evaporation rates and maintain a purity level defined by production standards. They yield film layers with measurable thickness and continuity. The materials remain stable at deposition temperatures and do not decompose. They adhere to various substrates, which preserves film integrity. They are employed in semiconductor components, radiation shielding and material research. They meet specified performance criteria for thin‐film production.

Specification:
Material
|
Lead
|
Appearance
|
Bluish‐white, metallic
|
Melting point (°C)
|
328
|
Thermal conductivity
|
35 W/m.K
|
Thermal expansion coefficient
|
28,9 x 10-6/K
|
Theoretical density (g/cc)
|
11.34
|
Applications:
1. Semiconductor devices: The material is used as a substrate or dopant in semiconductor manufacturing. It is employed in solar cells and optoelectronic devices.
2. Radiation shielding: The material is used to produce radiation protection products. It is applied in protective clothing, nuclear reactor barriers and medical radiation shields.
3. Chemical catalysis: The material is incorporated in catalysts for chemical reactions and energy conversions. It finds use in oil processing and organic synthesis.
4. Material research: The material is used as a test substance and a reference standard in studies of material structure and properties. It supports the progress of material science.
5. Nuclear engineering: The material is used as a control material in nuclear reactors by absorbing neutrons and maintaining stability in fission processes.
Packaging:
The evaporation materials are packaged to prevent damage during storage and transport. Packaging maintains product quality in its original state.