Description:
Nickel (Ni) evaporation materials are used in thin film deposition processes. They offer high purity and controlled evaporation rates, which ensure precise deposition on substrates. The materials are processed to enable uniform film formation with minimal defects. They exhibit thermal stability during deposition at elevated temperatures without degradation. The materials adhere to a range of substrates, thereby preserving the integrity and durability of deposited layers. They are used in semiconductor devices, metallurgical processes, and decorative coatings, thereby contributing to the progress in thin film technology.
Specification:
Material
|
Nickel
|
Appearance
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Glossy, metallic, silver-reflective
|
Melting point (°C)
|
1,453
|
Thermal conductivity
|
91 W/m.K
|
Thermal expansion coefficient
|
13.4 x 10-6/K
|
Theoretical density (g/cc)
|
8.91
|
Applications:
1. Semiconductor devices: Used for depositing metal layers, electrodes and interconnect wires in integrated circuits, solar cells and optoelectronic devices.
2. Alloy production: Employed as a component in the manufacture of alloys including corrosion‐resistant alloys, high‐strength steels and stainless steels.
3. Coatings: Used to produce corrosion‐resistant, decorative and conductive coatings in the automotive, construction and electronics industries.
4. Materials research: Utilised as a test material and reference standard to study the structure, properties and applications of nickel‐based materials in materials science.
5. Chemical reactions: Incorporated as a component in catalysts for use in organic synthesis, gas-phase catalysis and various chemical reactions.
Packaging:
The evaporation materials are packaged to prevent damage during storage and transport, thereby maintaining product quality in its original state.