Eisen-Nickel (Fe/Ni) Evaporation Materials Description
Stanford Advanced Materials (SAM) specialises in manufacturing high-purity evaporation materials for use in the semiconductor industry, chemical vapour deposition (CVD) and physical vapour deposition (PVD) in display and optical applications. Our technical, manufacturing and analysis teams work together to meet specified quantitative performance criteria. This collaboration ensures that our materials conform to relevant industry standards.
Specifications of Eisen-Nickel (Fe/Ni) Evaporation Materials
Materials
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Eisen-Nickel
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Density
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7.5–8.9 g/cm3
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Melting Point
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1435–1455 °C
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Purity
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99.9%
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Eisen-Nickel (Fe/Ni) Evaporation Materials Applications:
Our Eisen-Nickel evaporation materials are used in several technology sectors, including:
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Magnetic Devices: The materials are used in the deposition of magnetic thin films for sensors, data storage devices and read/write heads.
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Semiconductor Fabrication: They are suitable for semiconductor processes, including the deposition of thin films for integrated circuits.
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Optical Coatings: They are applied in the deposition of optical coatings on lenses, mirrors and filters.
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Surface Engineering: They are used to modify surface properties, improve wear resistance and reduce friction in various technical applications.
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Research and Development: They are employed in R&D projects that involve thin film deposition and materials science studies.
Eisen-Nickel (Fe/Ni) Evaporation Materials Specifications:
- Composition: Consists of iron (Fe) and nickel (Ni) in precise ratios.
- Purity: Materials are produced with 99.9% purity and controlled impurity levels.
- Forms: Available as pellets, granules and in custom configurations.
- Packaging: Packaged in vacuum-sealed containers to preserve material purity.
Eisen-Nickel (Fe/Ni) Evaporation Materials Features:
High Purity: The evaporation materials are produced with a measured purity of 99.9%, thereby ensuring low contamination levels and reliable film quality.
Precise Composition: The Fe/Ni ratios are strictly controlled to satisfy specified deposition parameters.
Uniform Film Thickness: The materials enable controlled deposition, which results in uniform film thickness across large substrate areas.
Thermal Stability: The materials maintain thermal stability during deposition, thereby reducing particulate release and ensuring consistent layer formation.
Wide Application Range: They are suitable for applications in magnetics, optics, electronics and surface engineering.
Custom Formulations: Custom formulations are available to meet individual specifications and application requirements.
Eisen-Nickel (Fe/Ni) Evaporation Materials Packaging
Our Eisen-Nickel (Fe/Ni) evaporation materials are clearly labelled to enable efficient identification and quality control. Care is taken during storage or transport to prevent any damage.