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Discontinued (Discontinued) ST6573 Nickel Copper Titanium Target (NiCuTi Target)

Catalogue Number ST6573
Chemical Composition Ni, Cu, Ti
Purity 99.95%, 99.99%
Shape Planar Disc

Stanford Advanced Materials (SAM) offers high-purity Nickel-Copper-Titanium Sputter Targets (NiCuTi Targets) which are designed for PVD processes (Physical Vapor Deposition) in the semiconductor industry, for optical coatings, and for other advanced industries. These targets combine the corrosion resistance of Nickel, the high electrical conductivity of Copper, and the lightweight strength of Titanium, meeting the requirements for precision thin film deposition. They are ISO 9001 certified and provide logistics and technical support to global standards.

Related products: Nickel Sputtering Target, Ni, Nickel-Cobalt Sputtering Target, Ni-Co, Copper Sputtering Target, Cu, Titanium Sputtering Target, Ti, Titanium Dioxide Sputtering Target, TiO2

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United Kingdom

    Purity

    99.9%

    • 99.9%
    • 99.5%
    • 99.99%
    • 99.999%
    • Other
    Diameter

    2''

    • 2''
    • 3''
    • 4''
    • 5''
    • 6''
    • Other
    Thickness

    0.25''

    • 0.25''
    • 0.125''
    • All
    • Other
    Bonding

    Yes

    • Yes
    • No
    • Other
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