ST6580 Aluminum Tin Copper Target (AlSnCu Target)

Aluminium Tin Copper Target (AlSnCu Target) Description

Aluminium Tin Copper Target (AlSnCu Target) is a multi-element sputtering material that exhibits a unique balance between lightweight properties, electrical conductivity, and mechanical adaptability. This alloy consists of Aluminium as the primary matrix with controlled additions of Tin and Copper, benefiting from the low density and corrosion resistance of Aluminium, while Copper enhances the electrical and thermal conductivity of the material. Tin contributes to improved lubricity and workability as well as increased wear and abrasion resistance. The target typically features a homogeneous microstructure achieved through advanced alloying and casting techniques, ensuring stable sputtering behaviour and uniform film composition. It has a moderate melting point and good thermal expansion compatibility with a range of substrates, making it suitable for use under controlled temperature conditions. The combination of these elements results in a target material with low internal stresses, good adhesion properties, and a stable surface morphology, which ensures reliable performance during prolonged sputtering processes.

Aluminium Tin Copper Target (AlSnCu Target) Specification

*The product information stated above is based on theoretical data. For specific requirements and detailed inquiries, please contact us.

Size

Aluminium Tin Copper Target (AlSnCu Target) Applications

• Semiconductor Connections: The target is used for depositing conductive layers with enhanced adhesion and reliability in microelectronic devices, where Aluminium provides low weight, Copper increases conductivity, and Tin improves solderability.
• Display Technologies: AlSnCu layers are employed in thin-film transistors (TFTs) and interconnections for LCDs and OLEDs, offering good structuring properties and surface uniformity.
• Flexible Electronics: Due to its ductility and good adhesion with polymer substrates, AlSnCu is suitable for use in portable or bendable electronic circuits.
• Printed Circuit Boards (PCBs): Utilised in sputtering processes for metallisation layers on high-density circuit boards, particularly for applications requiring strong mechanical connections and thermal management.
• Automotive Electronics: Ideal for sensor modules and control units in harsh environments, where resistance to oxidation and temperature fluctuations is critical.
• Energy Storage Devices: Applied in advanced battery and capacitor technologies for current collectors or electrode layers requiring low mass and high conductivity.

Aluminium Tin Copper Target (AlSnCu Target) Packaging

Our products are packaged in custom boxes of various sizes based on the material dimensions. Small items are securely packaged in PP boxes, while larger items are placed in bespoke wooden crates. We ensure strict adherence to packaging customisation and the use of appropriate cushioning materials to provide optimal protection during transit.

Packaging: Carton, Wooden crate, or custom.

Manufacturing Process

1. Brief Outline of the Manufacturing Process

2. Testing Procedures

1. Chemical composition analysis - Verified using techniques such as GDMS or XRF to ensure compliance with purity requirements.
2. Mechanical property testing - Includes assessments of tensile strength, yield strength, and elongation to evaluate material performance.
3. Dimensional measurement - Measures thickness, width, and length to ensure compliance with specified tolerances.
4. Surface quality examination - Inspection for defects such as scratches, cracks, or inclusions through visual and ultrasonic methods.
5. Hardness testing - Determines material hardness to confirm uniformity and mechanical reliability.

Frequently Asked Questions about Aluminium Tin Copper Targets (AlSnCu Targets)

Q1: What purity grades are available?

A1: SAM provides AlSnCu targets with purity grades of ≥99.99%, suitable for high-precision thin-film deposition applications.

Q2: Is this target compatible with both DC and RF sputtering systems?

A2: Yes, AlSnCu targets are compatible with both DC and RF sputtering techniques, depending on your specific equipment and film requirements.

Q3: What sputtering conditions are recommended?

A3: Typical working gases are high-purity Argon. The settings for sputtering power, pressure, and temperature should be optimised based on the chamber design and target size.

Performance Comparison Table with Competing Products

AlSnCu Target vs. Cu Target vs. AlSi Target:

Related Information

1. Raw Materials - Aluminium

Aluminium is a lightweight, silvery-white metal with the atomic number 13. It is known for its excellent corrosion resistance, high thermal and electrical conductivity, and low density (2.7 g/cm³), making it ideal for applications requiring structural integrity with minimal weight. Aluminium forms a natural oxide layer that protects it from further oxidation and is highly reflective and ductile, allowing it to be easily processed and alloyed with other metals.

2. Raw Materials - Tin

Tin is a soft, malleable transition metal with the atomic number 50. It has a relatively low melting point (231.9 °C), excellent formability, and high corrosion resistance, particularly against water and acidic environments. Tin is commonly used for surface coatings and alloys to enhance lubricity and solderability and to reduce wear in mechanical systems. In thin films, Tin can also influence deformability and wettability.

3. Raw Materials - Copper

Copper is a reddish-golden metal with the atomic number 29, valued for its exceptional electrical and thermal conductivity, surpassed only by Silver. It possesses high ductility, excellent formability, and high corrosion resistance in various environments. Copper is an essential material in electronics, for electrical wiring and metallisation processes. It is frequently alloyed to increase mechanical strength without significantly reducing conductivity.