Description of PBN/PG Composite Heating Elements
Pyrolytic Boron Nitride (PBN) is used as the substrate for the PBN heating element. Pyrolytic Graphite (PG) is deposited on the surface of the PBN plates via the CVD process to serve as both a conductor and a heating element. Depending on the application requirements, the PG heating element may subsequently be covered with PBN or remain exposed.
Because both PG and PBN are extremely pure (99.99% or higher) and remain stable in a vacuum or inert atmosphere, the PBN/PG composite heating elements offer a long service life and help keep the chamber clean. They can be heated to 1 600℃ within a short period without releasing gas components and exhibit resistance to acids and alkalis. These heating elements are intended for the semiconductor industry and for applications that require high temperatures, high vacuum, and high purity.
PBN/PG Composite Heating Elements Specifications
Diameter:
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0.5" to 4", or customised
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Apparent Density:
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2.0–2.19 g/cm3
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Maximum Operating Temperature (Vacuum):
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2 400℃
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Volume Resistivity (Ω-cm):
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3.11×1011
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Bending Strength (MPa):
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243.63
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Thermal Conductivity (W/m·K):
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43–60
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Customer-specific Service:
Form
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Wafer
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Rectangular
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Tube
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Size (mm)
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ø380 MAX
1.0–2.5
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265×265 MAX
1.0–2.5
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ø265 MAX
400 MAX length
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Sample
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Applications of PBN/PG Composite Heating Elements
- Heating of semiconductor substrates (in processes such as MBE, MOCVD, sputter coating, CVC, etc.).
- Heating of superconductor substrates.
- Sample heating for electron microscopes.
- Heating for metal deposition applications.
PBN/PG Composite Heating Elements Packaging
The PBN/PG composite heating elements are handled carefully during storage and transportation to preserve the product’s original condition.
25Kg per sack