Description of Copper Bonding Wire
Copper bonding wire is a material used in semiconductor packaging. It meets the required standards for electrical conductivity, thermal conductivity, mechanical strength and chemical stability. It is used as an inner lead in packaging and is a primary material in the manufacturing process of integrated circuits and semiconductor separators. Copper bonding wire provides cost efficiency and defined performance in mechanical and electrical properties. Stanford Advanced Materials (SAM) supplies copper bonding wire in various diameters ranging from 15 µm to 50 µm according to customer requirements.
Specifications of Copper Bonding Wire
Diameter
|
Properties
|
EL%
|
BL(CN)
|
15
|
0.6
|
2-8
|
2-8
|
3-6
|
5-13
|
5-13
|
9-15
|
16
|
0.63
|
2-8
|
2-8
|
3-6
|
5-13
|
5-13
|
9-15
|
17
|
0.67
|
2-8
|
2-8
|
4-7
|
5-13
|
5-13
|
10-16
|
18
|
0.7
|
3-9
|
3-9
|
4-7
|
7-15
|
7-15
|
10-16
|
19
|
0.75
|
3-9
|
3-9
|
4-7
|
7-15
|
7-15
|
10-16
|
20
|
0.8
|
4-10
|
4-10
|
5-9
|
8-18
|
7-15
|
10-18
|
23
|
0.9
|
5-11
|
5-11
|
7-11
|
8-18
|
8-16
|
12-19
|
25
|
1.0
|
6-12
|
6-12
|
9-13
|
8-18
|
8-16
|
13-21
|
28
|
1.1
|
8-15
|
8-15
|
11-17
|
10-20
|
8-16
|
14-22
|
30
|
1.2
|
10-18
|
10-18
|
13-20
|
15-21
|
8-16
|
14-23
|
32
|
1.25
|
10-30
|
10-30
|
16-23
|
15-21
|
10-20
|
14-23
|
33
|
1.3
|
10-30
|
10-30
|
16-23
|
15-21
|
10-20
|
14-23
|
35
|
1.4
|
10-30
|
10-30
|
23-30
|
15-21
|
10-20
|
15-25
|
38
|
1.5
|
15-35
|
15-35
|
23-30
|
15-22
|
10-20
|
15-25
|
42
|
1.65
|
22-42
|
22-42
|
25-33
|
15-22
|
10-20
|
15-25
|
44
|
1.73
|
22-42
|
22-42
|
15-25
|
15-22
|
10-20
|
15-25
|
45
|
1.8
|
22-42
|
22-42
|
15-25
|
15-22
|
10-20
|
15-25
|
50
|
2.0
|
30-50
|
30-50
|
40-55
|
15-22
|
10-20
|
15-25
|
Applications of Copper Bonding Wire
- Discrete semiconductor components
- Light emitting diodes (LEDs)
- Integrated circuits