Description of Silver Alloy Bond Wire
The bond wire is a material used in semiconductor packaging. It exhibits electrical conductivity, thermal conductivity, mechanical performance and chemical stability. SAM can supply Ag-bond wire with diameters from 15 µm to 30 µm as specified by customers.
Characteristics of Silver Alloy Bond Wire
- Possesses improved physical properties relative to Au bond wire
- Requires less complex storage than copper
- No gas shielding is required, thereby reducing production costs
- Involves lower acquisition costs than Au wire
- Does not oxidise in clean air

Specifications of Silver Alloy Bond Wire
Diameter
|
Properties
|
EL%
|
BL (CN)
|
µm
|
mil
|
AABW-1
|
AABW-2
|
AABW-3
|
AABW-1
|
AABW-2
|
AABW-3
|
15
|
0.6
|
2-8
|
2-8
|
2-8
|
>2.5
|
>2.5
|
>3
|
16
|
0.63
|
2-8
|
2-8
|
2-8
|
>2.5
|
>2.5
|
>3
|
17
|
0.67
|
2-8
|
2-8
|
2-8
|
>2.5
|
>3
|
>4
|
18
|
0.7
|
2-8
|
2-8
|
2-8
|
>2.5
|
>3
|
>4
|
19
|
0.75
|
2-8
|
2-8
|
2-8
|
>2.5
|
>3
|
>5
|
20
|
0.8
|
2-10
|
2-8
|
2-8
|
>4
|
>4
|
>6
|
23
|
0.9
|
2-12
|
2-8
|
2-8
|
>5
|
>6
|
>8
|
25
|
1.0
|
2-12
|
2-8
|
2-8
|
>7
|
>8
|
>10
|
27
|
1.06
|
2-12
|
2-8
|
2-8
|
>8
|
>9
|
>12
|
28
|
1.1
|
2-12
|
2-8
|
2-8
|
>8
|
>9
|
>12
|
30
|
1.2
|
2-14
|
2-10
|
2-10
|
>11
|
>12
|
>14
|
33
|
1.3
|
2-14
|
2-10
|
2-10
|
>12
|
>13
|
>15
|
35
|
1.4
|
2-14
|
2-10
|
2-10
|
>12
|
>13
|
>15
|
37
|
1.45
|
2-14
|
2-10
|
2-10
|
>15
|
>16
|
>17
|
38
|
1.5
|
2-16
|
2-12
|
2-10
|
>17
|
>18
|
>20
|
40
|
1.6
|
2-16
|
2-12
|
2-10
|
>18
|
>20
|
>20
|
42
|
1.65
|
2-16
|
2-12
|
2-10
|
>18
|
>20
|
>25
|
45
|
1.8
|
2-16
|
2-12
|
2-10
|
>18
|
>20
|
>25
|
50
|
2.0
|
3-18
|
3-10
|
3-10
|
>20
|
>25
|
>30
|
Applications of Silver Alloy Bond Wire
- Discrete semiconductor components
- Light-emitting diodes (LEDs)
- Integrated circuits