AU2029 Gold Bonding Wire

Catalogue Number	AU2029
Material	Pure gold (Au)
Purity	2N-4N
Diameter	13-70μm
Length	100-500m

We can adjust the diameter of gold bonding wires to meet each customer’s specification. Calibrated instruments are used to verify the wire diameters. Stanford Advanced Materials (SAM) supplies metal bonding wires.

Other related products include copper bonding wire and aluminium bonding wire. They also include silver bonding wire and silver alloy bonding wire.

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Mechanical Properties
Diameter		EL%	Properties
Diameter			BL (CN)
µm	mil		AUBW02	AUBW03/AUBW06	AUBWD05/AUBWD07	AUBWD01/AUBWD03/AUBWD99/ AUBWD06/AUBW10
13	0.5	2-5	/	>2.5	>2.5	>3.0
14	0.55	2-5	/	>3.0	>3.0	>3.0
15	0.6	2-5	/	>3.0	>3.5	>4.0
16	0.63	2-5	>2.5	>3.0	>3.5	>4.0
17	0.67	2-5	>2.5	>3.0	>3.5	>4.0
18	0.7	2-5	>2.5	>3.5	>4.0	>5.0
19	0.75	2-6	>3.0	>4.0	>4.5	>5.5
20	0.8	2-6	>4.0	>4.5	>6.0	>6.0
21	0.83	2-6	>4.5	>5.0	>6.0	>6.5
22	0.87	2-7	>4.5	>5.5	>6.0	>7.0
23	0.9	2-7	>5.0	>6.0	>7.0	>8.0
24	0.94	2-7	>6.0	>6.5	>7.5	>9.0
25	1	2-8	>7.0	>8.0	>10.0	>10.0
28	1.1	2-8	>9.0	>10.0	>12.0	>11.0
30	1.2	3-8	>11.0	>12.0	>13.0	>15.0
32	1.25	3-8	>12.0	>13.0	>15.0	>16.0
33	1.3	3-8	>13.0	>14.0	>16.0	>18.0
35	1.4	3-10	>15.0	>16.0	>18.0	>22.0
38	1.5	3-10	>17.0	>18.0	>21.0	>22.0
40	1.57	3-10	>20.0	>22.0	>24.0	>26.0
45	1.8	3-12	>24.0	>25.0	>28.0	>30.0
50	2	3-12	>30.0	>32.0	>34.0	>36.0
60	2.4	7-14	>43.0	>45.0	>50.0	>52.0
70	2.8	7-14	>50.0	>55.0	>60.0	>63.0

Theoretical Physical Properties
Density	19.34 g/cm³
Melting Point	1063℃
Electrical Resistivity @20℃	2.3 μΩ·cm
Electrical Conductivity @20℃	75% (IACS)
Thermal Conductivity @20℃	315 W/(m·K)
Fusing Current (10 mm x 25 μm)	0.52 A

Composition	Diameter		Tensile Strength	Elongation
Composition	mil	μm	gms	%
99.99%Au	0.7	17.5	3-10	2-6
	0.8	20	4-13	2-7
	0.9	22.5	5-16	2-8
	1.0	25	6-20	2-8
	1.3	32.5	10-45	2-10
	1.5	37.5	13-50	2-12
	1.7	42.5	15-60	2-12
	1.8	45	20-70	2-12
	2.0	50	25-85	2-15
	3.0	75	50-180	2-20

AU2029 Gold Bonding Wire

Gold Bonding Wire Description

Specifications for Gold Bonding Wire

Gold Bonding Wire Applications

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