AL10297 Aluminium Nitride AlN Ceramic Substrate 25.4 mm x 25.4 mm x 0.5 mm

Aluminium Nitride AlN Ceramic Substrate 1 inch x1 inch x 0.5 mm Description

Aluminium Nitride (AlN) Ceramic Substrate, sized 1 inch x1 inch x 0.5 mm, is engineered for applications requiring efficient thermal management and electrical insulation. The precise dimensions facilitate integration into semiconductor packaging and high-power electronic assemblies. Its high thermal conductivity supports effective heat dissipation, while the refined microstructure minimises defects. Rigorous quality control through SEM and XRD ensures consistency in material properties critical for advanced electronic systems.

Aluminium Nitride AlN Ceramic Substrate 1 inch x1 inch x 0.5 mm Applications

1.       Electronics Applications
- Use as a heat spreader in high-power devices to achieve effective thermal management by leveraging its excellent thermal conductivity.
- Applied as an insulating substrate in RF modules to maintain signal integrity by providing stable electrical performance.

2.       Semiconductor Packaging
- Used as a base component in power modules to achieve precise heat dissipation by leveraging the controlled microstructure.
- Applied as a mounting substrate in microelectronic assemblies to minimise thermal stress and enhance reliability.

3.       LED Lighting Systems
- Used as a support plate in LED arrays to achieve efficient heat distribution by leveraging the substrate’s superior thermal properties.

Aluminium Nitride AlN Ceramic Substrate 1 inch x1 inch x 0.5 mm Packing

The substrate is individually sealed in anti-static, moisture-resistant pouches and cushioned within foam-lined containers to prevent physical damage during transit. It is stored in temperature- and humidity-controlled conditions to maintain material integrity. Custom packaging options, including compartmentalised trays and specific labelling, are available upon request to meet precise handling and storage protocols.

Frequently Asked Questions

Q1: What thermal properties are verified for this AlN substrate?
A1: Measurements indicate the substrate exhibits high thermal conductivity, which is crucial for dispersing heat in electronic applications. Standard testing employs calibrated thermal conductivity analysers to ensure consistency and performance within specified ranges.

Q2: How is dimensional accuracy maintained during production?
A2: Production incorporates precision machining and laser micrometry to keep the 1" x1" square and 0.5 mm thickness within tight tolerances. This strict control ensures the substrate reliably fits within standard electronic assembly specifications.

Q3: Which quality control methods are applied in the manufacturing process?
A3: Quality control involves SEM imaging and XRD analysis to inspect the microstructure and phase purity. These methods help detect any material anomalies early, ensuring the substrate meets the required performance criteria.

Additional Information

Ceramic substrates based on aluminium nitride play an essential role in thermal management for electronic assemblies. Their unique combination of electrical insulation and high thermal conductivity makes them suitable for environments that require efficient heat dissipation. Recent advancements in sintering technology have improved microstructural control, directly impacting the performance of these materials in high-power applications.

The development of AlN substrates involves rigorous characterisation techniques. Methods such as scanning electron microscopy and X-ray diffraction are routinely employed to assess material uniformity and crystalline orientation. Such thorough evaluations contribute to an improved understanding of material behaviour under operational stresses, fostering innovation in thermal management and electronic packaging solutions.