AL10298 Aluminum Nitride AlN Ceramic Substrate 10x10x 0.5 mm

Aluminium Nitride AlN Ceramic Substrate 10x10x0.5 mm Description

Aluminium Nitride AlN Ceramic Substrate 10x10x0.5 mm is a ceramic component fabricated from high-purity aluminium nitride. The 10x10 mm dimension and 0.5 mm thickness are maintained within tight tolerances to accommodate precise assembly in electronic packages and thermal management systems. Its material characteristics support effective heat dissipation and electrical insulation, making it a critical component in environments requiring high thermal and dielectric performance.

Aluminium Nitride AlN Ceramic Substrate 10x10x0.5 mm Applications

1.       Electronics Applications
- Used as a heat spreader in LED modules to dissipate heat by leveraging AlN’s high thermal conductivity.
- Applied as an insulating substrate in power electronics to manage thermal load and maintain electrical separation.

2.       Industrial Applications
- Employed as a base component in sensor arrays to achieve consistent signal integrity by utilising the material’s dielectric properties.
- Serves as a mounting platform in high-temperature circuits to secure component stability by taking advantage of its controlled thermal expansion.

Aluminium Nitride AlN Ceramic Substrate 10x10x0.5 mm Packing

The ceramic substrates are individually packaged in anti-static pouches with foam inserts to prevent mechanical impact. The packages are sealed to minimise contamination and stored in temperature-controlled conditions. Protective cushioning and moisture-barrier liners are used throughout the distribution process. Custom packaging options, including compartmentalisation and specific labelling, are available to meet specialised logistics requirements.

Frequently Asked Questions

Q1: How does the dimensional tolerance of the substrate support its integration in electronics?
A1: The controlled dimensions of 10x10 mm and a uniform thickness of 0.5 mm ensure compatibility with standard electronic assembly processes, which aids in reliable integration and heat dissipation in compact designs.

Q2: What role does aluminium nitride’s thermal conductivity play in performance?
A2: Aluminium nitride’s high thermal conductivity enables effective heat transfer away from sensitive components, reducing thermal stress and contributing to the stability of electronic circuits under high operational loads.

Q3: Can the substrate’s surface finish affect its application in high-performance systems?
A3: Yes, a finely finished substrate minimises surface defects and irregularities, ensuring optimal adhesion and thermal contact when interfaced with semiconductor devices, thereby enhancing overall system performance.

Additional Information

Aluminium nitride is valued in materials science for its combination of high thermal conductivity and good electrical insulation. These properties are crucial for devices operating under significant thermal loads. The material’s behaviour under temperature variations and its interaction with metallisation layers are critical factors in the design of power electronics and thermal management systems.

Research into ceramic substrates continues to refine processing techniques and quality control measures. Advances in material synthesis and precision fabrication contribute to improved performance in applications requiring controlled thermal profiles and electrical stability, supporting ongoing innovation within various industries.