AL10306 Aluminium Nitride AlN Ceramic Substrate 1 inch x 1 inch x 0.635 mm

Aluminium Nitride AlN Ceramic Substrate 1 inch x1 inch x 0.635 mm Description

Aluminium Nitride (AlN) ceramic substrates feature a composition that supports enhanced thermal conductivity and stability at elevated temperatures. The dimensions of 1 inch by 1 inch with a thickness of 0.635 mm enable compatibility with standard electronic assembly processes. The dense microstructure minimises thermal resistance, making this substrate suitable for applications in power electronics and LED modules where controlled heat dissipation is critical. Its inert chemical nature offers additional protection against environmental degradation.

Aluminium Nitride AlN Ceramic Substrate 1 inch x1 inch x 0.635 mm Applications

Electronics Applications
- Used as a heat spreader in LED modules to achieve improved thermal regulation by leveraging high thermal conductivity, mitigating performance issues associated with overheating.
- Applied as a substrate in high-power semiconductor devices to facilitate efficient heat management, thereby reducing the risk of thermal-induced failures.

Industrial Applications
- Serves as a component in power electronics assemblies where uniform substrate characteristics provide enhanced circuit stability via effective heat dissipation.
- Frequently used in sensor packaging to reduce temperature-related variances, ensuring accurate signal processing through minimised thermal gradients.

Aluminium Nitride AlN Ceramic Substrate 1 inch x1 inch x 0.635 mm Packing

The substrate is securely packaged in an anti-static, cushioned container to prevent mechanical damage and contamination. It is encased in a protective film that shields against particulate matter and moisture during transit. For optimal preservation of material properties, the packaging recommends storage in a clean, temperature-controlled environment. Custom packaging options, including specialised inserts and labelling, are available upon request.

Frequently Asked Questions

Q1: What quality control measures ensure the substrate’s uniformity?
A1: The substrate undergoes dimensional inspections and scanning electron microscopy (SEM) at various production stages. These techniques detect microstructural variations, ensuring the material meets thermal and mechanical specifications for demanding applications.

Q2: How should the substrate be stored to maintain its properties?
A2: Storage should be in a clean, dry, and temperature-stable environment to prevent moisture absorption and particulate contamination. Anti-static packaging is recommended to maintain the material’s performance in sensitive electronic applications.

Q3: Is it possible to customise substrate dimensions or thickness?
A3: Customisation options are available based on technical requirements. Changes in dimensions or thickness are accommodated through adjusted sintering protocols and process control, provided that the thermal and mechanical properties remain consistent with application needs.

Additional Information

Aluminium Nitride (AlN) is widely utilised in ceramics due to its high thermal conductivity and electrical insulation properties. These attributes make it an essential material in applications where temperature regulation and electrical performance are critical. The unique microstructure achieved through precise sintering methods plays a vital role in maintaining its physical and chemical stability.

In advanced electronics and industrial settings, understanding the thermal behaviour of ceramic substrates is crucial for system reliability. Studies on AlN have shown that proper control of grain size and density directly influences heat transfer efficiency. As a result, technical improvements in manufacturing continue to enhance the performance and integration of such substrates in thermal management solutions.