CY9461 Molybdenum Polycrystalline Substrate 10x10x0.5 mm, DSP

Molybdenum Polycrystalline Substrate 10x10x0.5 mm, DSP Description

The Molybdenum Polycrystalline Substrate measures 10x10x0.5 mm and is processed using a DSP (double-side polished) method to ensure a uniform and flat surface. Molybdenum’s inherent resistance to high temperatures and chemical inertness make this substrate well-suited for integration in semiconductor fabrication and advanced research environments. Controlled grain structure and minimal surface roughness further support its application in precise material processing setups.

Molybdenum Polycrystalline Substrate 10x10x0.5 mm, DSP Applications

1.       Electronics and Semiconductor Manufacturing
- Used as a substrate in semiconductor processing to achieve uniform thermal distribution by leveraging molybdenum’s high melting point.
- Applied as a base for thin film deposition in electronic circuits to improve flatness and dimensional control due to its polished surface.

2.       Materials Research and Process Development
- Serves as a support for testing thin film growth in material science laboratories to achieve consistent deposition behaviour by utilising its controlled crystallographic orientation.
- Frequently used in calibration of analytical instruments in research environments for its stable physical properties.

Molybdenum Polycrystalline Substrate 10x10x0.5 mm, DSP Packing

The substrate is packaged individually in anti-static, moisture-resistant pouches and secured in protective foam inserts within a rigid container. The packaging ensures minimal exposure to contaminants and mechanical stress during transit. It is advised to store the substrates in a clean, temperature-controlled environment to maintain their surface integrity. Customised packaging can be arranged if required for specialised handling or storage conditions.

Frequently Asked Questions

Q1: What role does the DSP process play in the substrate's performance?
A1: The DSP (double-side polished) process minimises surface irregularities, achieving a uniform flatness needed for precise thin film deposition and semiconductor applications.

Q2: How is grain structure controlled in these substrates?
A2: Controlled annealing and inspection with scanning electron microscopy (SEM) are employed to monitor and ensure uniform grain orientation, which is critical for maintaining consistent material properties.

Q3: What are the key considerations for integrating this substrate into high-temperature processes?
A3: Molybdenum’s high melting point and chemical inertness make it suitable for elevated temperature applications. However, handling protocols must ensure minimal contamination and prevent thermal shock during process integration.

Additional Information

Molybdenum is widely recognised in materials science for its high durability and thermal stability. It is utilised in scenarios where materials must sustain high temperatures and resist chemical corrosion. The use of polycrystalline substrates offers a balance between cost and performance, permitting researchers to explore surface phenomena without compromising structural integrity.

The application of advanced polishing techniques, alongside rigorous quality control methods, ensures that such substrates consistently meet strict dimensional and surface roughness criteria. This makes them valuable in precision engineering environments, where even minor surface variations can impact experimental outcomes and device performance.