ST10712 Platinum Rotary Sputtering Target Pt Target

Platinum Rotary Sputtering Target Pt Target Description

Platinum Rotary Sputtering Target Pt Target is specifically engineered for application in physical vapour deposition systems. The target, made from high-purity platinum, is designed with a controlled microstructure that supports consistent sputter yields and minimises particulate generation. Its chemical inertness and high melting point make it advantageous for depositing ultra-thin films in semiconductor processing and other advanced coating procedures.

Platinum Rotary Sputtering Target Pt Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Platinum Rotary Sputtering Target Pt Target Applications

Electronics
- Used as the sputtering source in thin film deposition systems to achieve uniform, high-purity coatings by leveraging platinum's high melting point and chemical inertness.
- Applied as a target in the fabrication of microelectronic devices, where its controlled microstructure improves film consistency and reduces particulate contamination.

Industrial
- Employed as a coating material for protective layers in high-corrosion environments. Its chemical stability helps in enhancing the lifespan of critical components exposed to aggressive media.

Platinum Rotary Sputtering Target Pt Target Packing

The target is packaged in antistatic, cleanroom-grade materials and sealed in moisture-proof, cushioned containers. This packaging minimises surface damage and contamination during transit and storage. The product must be stored in a controlled-temperature, low-humidity environment. Custom packaging options, including vacuum sealing and compartmentalised inserts, are available upon request to meet specific handling and storage requirements.

Additional Information

Platinum as a material has distinct chemical and physical properties that make it suitable for high-temperature and corrosive environments. Its inert nature and high melting point are particularly valuable in sputtering applications, where consistent performance and durability are essential.

The use of platinum in sputtering targets is critical for applications demanding uniform thin film deposition. Advances in metallurgical processing and analytical techniques have enabled the production of targets with tightly controlled microstructures, minimising variability during film growth in semiconductor and industrial coating processes.