ST11168 Aluminium Oxide Planar Sputtering Target, Al2O3 Target

Aluminium Oxide Planar Sputtering Target, Al2O3 Target Description

The Aluminium Oxide Planar Sputtering Target, Al2O3 Target is composed of high-purity alumina (Al2O3) formulated for sputtering applications. Its planar design ensures compatibility with standard deposition systems by maintaining uniform target-to-substrate spacing. This geometry minimises edge effects during sputtering, promoting consistent film growth and reducing particulate contamination. The target's rigorous compositional control supports stable sputtering behaviour and reproducible thin film properties, beneficial for semiconductor and optical component processes.

Aluminium Oxide Planar Sputtering Target, Al2O3 Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Aluminium Oxide Planar Sputtering Target, Al2O3 Target Applications

Electronics
- Used as a deposition target in sputtering systems to achieve uniform thin films for semiconductor devices by leveraging the target's high-purity alumina composition.
- Applied as a coating source in optical display manufacturing to control film thickness and quality, ensuring minimal particulate defects.

Industrial
- Employed as a sputtering target in the fabrication of protective coatings for flat panel devices by utilising its planar geometry for even material distribution.
- Integrated in the production of dielectric layers in sensor applications to achieve a stable and reproducible deposition environment.

Aluminium Oxide Planar Sputtering Target, Al2O3 Target Packing

The target is securely packaged in anti-static foam-lined containers with inert gas cushioning to prevent damage and contamination. It is stored at ambient temperature in a clean, dry facility to preserve surface integrity. Customised packaging solutions, including vacuum-sealed pouches and compartmentalised boxes, are available as per specific handling requirements and shipment conditions.

Additional Information

Sputtering is a widely adopted physical vapour deposition technique where targets such as aluminium oxide are essential for creating thin, uniform films. The planar geometry of the target allows for effective energy distribution during sputtering, which is critical for high-precision applications in semiconductor and optical device manufacturing. Maintaining high purity and controlled surface properties is imperative for process reproducibility.

Aluminium oxide, also known as alumina, exhibits excellent chemical inertness and mechanical strength, making it a preferred material for various ceramic applications. Insight into its thermal and dielectric properties assists engineers in optimising deposition processes and ensuring device performance meets rigorous industrial standards.

Case

ASML Lithography Machine Lens

193nm Anti-Reflective Coating System

Substrate: Synthetic Quartz | Deposition Temperature: 150°C

Performance Verification:

Single-Side Reflectance Loss < 0.08%

Wavefront Distortion < λ/40 @ 193nm

Process Plan: Ion Beam Assisted Deposition (IAD) for Density Optimisation