ST11170 Aluminum Silicon Planar Target, AlSi Target

Aluminium Silicon Planar Target, AlSi Target Description

Aluminium Silicon Planar Target, AlSi Target is a sputtering target manufactured from an aluminium-silicon alloy. The product features a customisable dimension to facilitate integration with standard deposition systems. Its controlled alloy composition enhances film uniformity and minimises contamination, supporting efficient deposition processes in semiconductor and coating fabrication applications.

Aluminium Silicon Planar Target, AlSi Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Aluminium Silicon Planar Target, AlSi Target Applications

Electronics
- Used as a sputtering target in semiconductor deposition chambers to achieve thin film uniformity by utilising controlled alloy composition.
- Applied as a deposition source in microelectronic device manufacturing to produce consistent conductive layers using its precisely tailored material properties.

Industrial Coatings
- Serves as the material source in coating processes to deliver uniform film properties by utilising its consistent, high-purity aluminium-silicon composition.
- Applied in surface modification techniques to enhance adhesion and durability in industrial component finishing.

Photovoltaics
- Used as a target in solar cell fabrication to ensure uniform deposition of metallic layers by utilising its customisable dimensions and composition control.
- Applied in photovoltaic module production to achieve improved electrical conductivity and interface consistency.

Aluminium Silicon Planar Target, AlSi Target Packing

The target is packaged in sealed, anti-static containers with moisture-resistant and cushioning inserts to prevent mechanical damage during transit. Protective foam and nitrogen purging are employed to minimise contamination and oxidation. The packaging ensures stable storage conditions in a cool, dry environment. Custom packaging solutions are available to accommodate unique handling requirements.

Additional Information

Sputtering targets play a fundamental role in thin-film deposition processes by acting as the source material for layer formation. The aluminium-silicon alloy used in these targets is selected due to its balance of conductivity and structural integrity. Precision in target composition directly correlates with film uniformity, which is essential in semiconductor and coating industries.

Recent advances in sputtering technology emphasise the importance of controlled material properties and surface finishes. Ongoing research in materials science continues to refine alloy formulations to meet increasingly stringent industrial specifications, ensuring that deposition processes remain both efficient and reproducible.