ST11171 Aluminum Tin Copper Rotary Target, AlSnCu Target

Aluminium Tin Copper Rotary Target, AlSnCu Target Description

Aluminium Tin Copper Rotary Target, AlSnCu Target is an aluminium-based alloy designed specifically for sputtering applications. The target's composition provides controlled levels of tin and copper to enhance sputtering efficiency and film uniformity. Its rotary design facilitates even material erosion over prolonged usage. Precise metallurgical processing yields a uniform microstructure, ensuring compatibility with industrial sputtering systems and maintaining consistent deposition characteristics throughout its service life.

Aluminium Tin Copper Rotary Target, AlSnCu Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Aluminium Tin Copper Rotary Target, AlSnCu Target Applications

Electronics
- Used as a sputtering target in semiconductor deposition to achieve uniform thin film formation by leveraging its controlled alloy composition.
- Applied as a material source in MEMS fabrication to maintain consistent film properties through stable erosion behaviour.

Industrial Coatings
- Serves as deposition material in physical vapour deposition systems to ensure even coating formation on industrial components by utilising its homogeneous microstructure.
- Frequently used in manufacturing processes where consistent film thickness is critical for product performance.

Optical Devices
- Implemented as a target for reflective coating deposition in optical assemblies to attain a smooth, uniform finish using controlled alloy characteristics.
- Applied in sensor fabrication to provide precise film uniformity that enhances optical clarity and performance.

Aluminium Tin Copper Rotary Target, AlSnCu Target Packing

The target is packaged in cleanroom-grade, anti-static containers with a moisture barrier seal to prevent contamination. It is individually wrapped in low-shedding film and cushioned to guard against mechanical shock. Storage instructions recommend a cool, dry environment free from particulate ingress. Custom packaging options are available to meet specific process equipment requirements and handling protocols.

Additional Information

The performance of aluminium-based alloys in sputtering applications depends on a careful balance of alloying elements. Understanding the interplay between tin, copper, and aluminium is crucial for predicting film characteristics and target erosion. Research in alloy phase diagrams and metallurgical processing continues to inform improvements in target fabrication.

Advances in sputtering technology increasingly require targets with precise compositional control and consistent microstructure. Engineers and scientists collaborate to refine annealing, deposition, and quality control methods. This ongoing research supports the development of reliable targets that meet rigid specifications for electronic, optical, and industrial applications.