ST11172 Aluminium Zinc Indium Silicon Planar Target, AlZnInSi Target

Aluminium Zinc Indium Silicon Planar Target, AlZnInSi Target Description

Aluminium Zinc Indium Silicon Planar Target, AlZnInSi Target is engineered for sputtering deposition in microelectronics and thin film applications. The unique multi-element composition ensures a balanced sputtering yield while its customisable dimensions support various system integrations. The controlled planar structure facilitates uniform film growth and minimises compositional variation, addressing the specific technical demands of semiconductor processing and surface coating applications.

Aluminium Zinc Indium Silicon Planar Target, AlZnInSi Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Aluminium Zinc Indium Silicon Planar Target, AlZnInSi Target Applications

Electronics
- Used as a sputtering target in semiconductor deposition to achieve uniform thin film coatings through its controlled elemental composition.
- Applied in microelectronic device fabrication to produce consistent barrier layers that reduce defect density.

Industrial Coatings
- Serves as a component in physical vapour deposition systems to form protective layers on industrial components, reducing surface wear through a balanced alloy composition.
- Employed in the production of decorative coatings where controlled film uniformity enhances appearance and durability.

Renewable Energy Devices
- Used in the deposition of thin film layers for photovoltaic cells to improve electrical conversion efficiency by utilising its precise planar structure and alloy consistency.
- Applied in sensor fabrication within renewable energy systems to ensure a homogeneous response through controlled sputtering deposition.

Aluminium Zinc Indium Silicon Planar Target, AlZnInSi Target Packing

The target is packaged in anti-static, cushioned carriers to limit mechanical shocks and particulate contamination. Packaging incorporates moisture barriers and temperature-resistant materials for optimal protection during shipping and storage. The product is sealed in inert atmosphere bags to reduce oxidation risks. Customised packaging options are available to accommodate specific handling or installation requirements.

Additional Information

The development of sputtering targets necessitates a thorough understanding of material behaviour under plasma conditions. Alloy compositions optimised for sputtering demonstrate unique interactions with ionised gases, which can alter deposition rates and film properties. Engineers often rely on detailed process simulations and iterative testing to fine-tune sputtering parameters.

In the broader scope, advancements in sputtering targets have contributed significantly to the refinement of semiconductor manufacturing and thin film technologies. Enhanced material consistency and controlled deposition processes are central to improving performance in various industrial applications, from electronics to energy conversion systems.