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ST11179 Cobalt Iron Tantalum Boron Planar Target, CoFeTaB Target

Catalogue Number ST11179
Composition CoFeTaB
Purity ≥99.9%, or customized
Form Target
Shape Rectangular
Dimensions Customized

Cobalt Iron Tantalum Boron Planar Target, CoFeTaB Target is produced with precise elemental control and a flat, uniform surface optimised for sputtering deposition. Stanford Advanced Materials (SAM) employs spectrometric analysis and microstructural inspection during production to monitor alloy homogeneity. The process parameters are rigorously measured to maintain controlled film erosion and deposition rates, ensuring that each target delivers consistent performance during processing.

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FAQ

How does the planar design of the CoFeTaB target improve film deposition uniformity?

The planar geometry ensures an even plasma distribution across the target surface during sputtering, which minimises localised erosion and promotes consistent film thickness. This uniformity is critical for maintaining the performance integrity of deposited films in semiconductor applications.

What quality control measures are implemented in the production of CoFeTaB targets?

Production involves routine spectrometric analysis and detailed microstructural inspection. These measures verify alloy composition and target surface uniformity, reducing variations in deposition performance. For further details, contact us.

Can the target dimensions be customised to suit specific sputtering systems?

Yes, the target dimensions are customisable, allowing integration with various sputtering equipment designs. Tailoring the target size facilitates optimal alignment and deposition uniformity across different manufacturing setups.

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