ST11188 Iron Rotary Target, Fe Target

Iron Rotary Target, Fe Target Description

Iron Rotary Target, Fe Target is a sputtering target composed of high-purity iron (Fe) and manufactured to tight dimensional specifications. Its customisable design ensures compatibility with diverse sputtering systems used in semiconductor and coating industries. The controlled composition minimises impurity levels, leading to consistent film deposition. Stanford Advanced Materials employs rigorous spectrometric quality control to monitor material uniformity, which is critical for applications that demand precise layer thickness and minimal defect density.

Iron Rotary Target, Fe Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Iron Rotary Target, Fe Target Applications

Electronics
- Used as a deposition target in sputtering systems for semiconductor device fabrication to achieve consistent film thickness by leveraging controlled material purity. 

Industrial
- Applied as the source material for protective coatings on structural components to enhance corrosion resistance by utilising customisable dimensions and uniform composition. 

Energy
- Serves as a target for fabricating magnetic cores in energy conversion devices to improve magnetic performance by capitalising on the stable deposition characteristics of iron.

Iron Rotary Target, Fe Target Packing

The Iron Rotary Target, Fe Target is packaged in moisture-resistant, anti-static containers with foam-lined inserts to prevent damage during transport and storage. Protective polyethylene wrapping minimises oxidation and particulate contamination. The packaging ensures the target remains in a controlled environment, and options for customised packaging, including labelling and compartmentalised arrangements, are available to meet specific handling requirements.

Additional Information

Iron targets are critical components in sputtering deposition systems, where material purity and dimensional accuracy directly impact film properties. The controlled release of atoms from an iron target ensures even coating layers and reduced defect formation in thin films.

Understanding the interplay between material characteristics and deposition parameters is essential for optimising sputtering processes. Advances in production techniques enable precise control over target properties, thereby supporting enhanced performance in semiconductor manufacturing and industrial coating applications.