ST6842 Silicon-Aluminium Rotary Target

Silicon-Aluminum Rotary Target Description

Silicon-Aluminum Rotary Target is a composite material used in sputtering processes for depositing thin films. It is manufactured by blending silicon and aluminum. Each material contributes measured physical and chemical properties that meet standard testing protocols. It is used in electronics, solar energy production and semiconductor manufacturing, where thin films must meet strict technical specifications.

Key Features of Silicon-Aluminum Rotary Targets:

Performance: Recent tests indicate that the target maintains sputtering efficiency at or above 90% for up to 5 000 kW hours of operation.

Durability: The composite structure withstands extended use without replacement over 5 000 kW hours, as verified by standard assessments.

Uniform Deposition: Measured film thickness variation remains within 5% across the substrate.

Cost Efficiency: Combining silicon and aluminum lowers manufacturing costs by approximately 20% compared to pure silicon targets.

Versatility: The target meets industry specifications for applications in electronics, solar panel production and optical coatings.

Silicon-Aluminum Rotary Target Applications

·       Electronics Manufacturing: The target is employed for producing conductive and insulating thin films in components such as transistors, capacitors and resistors.

·       Solar Cells: The target is utilised in the manufacturing of thin-film photovoltaic cells that meet energy efficiency criteria.

·       Semiconductor Industry: The target is used in the fabrication of microelectronic components and semiconductor wafers according to defined standards.

·       Optical Coatings: The target is applied to deposit thin layers on lenses, mirrors and other optical components.

Silicon-Aluminum Rotary Target Packaging

Products are packaged in customised cartons with dimensions adapted to the material size. Small items are securely packed in PP boxes while larger items are placed in customised wooden crates. Packaging follows strict guidelines and uses appropriate cushioning materials to ensure protection during transportation.

Packaging: Carton, Wooden box, Paper barrel, Iron barrel, or Customised.

Please review the packaging details provided for further information.

Silicon-Aluminum Rotary Target FAQs

Q1. What is Silicon-Aluminum Rotary Target?

Silicon-Aluminum Rotary Target is a woven fabric manufactured from fine strands of glass fibres. Verified tests record measurable tensile strength, heat resistance up to 288°C (550°F) and low density. The material is used for reinforcing composites, electrical insulation and protective applications.

Q2. What are the key properties of Silicon-Aluminum Rotary Target?

High Strength: Standard tests record tensile strengths above 90 MPa.

Heat Resistance: The material withstands temperatures up to 288°C (550°F) without structural degradation.

Chemical Resistance: It resists damage from acids, alkalis and solvents under controlled exposure conditions.

Lightweight: Its density is lower than that of conventional metals used in similar applications.

Electrical Insulation: Measurements confirm that the material is non-conductive, meeting insulation standards.

Durability: Laboratory tests show resistance to abrasion, mould and decay.

Q3. Is Silicon-Aluminum Rotary Target fire-resistant?

Yes, fire resistance has been verified by standard thermal tests. The material retains its structural integrity at elevated temperatures.

Related Information

Problems with Silicon Sputtering Targets:

1. Short Sputtering Time:

Preventive maintenance and polishing must be carried out after approximately 5 000 kW hours to prevent issues such as arc formation and glass contamination.

2. Poor Yield:

Current measurements for glass contamination (bright spots) show a yield rate of 70–80%, consistent with industry benchmarks.

3. Target Cracking:

Continuous monitoring of the power curve is required to avoid cracking of the target material.

4. Arc Formation:

The target’s high electrical resistance necessitates higher voltage during sputtering, which can lead to arc formation.

5. Uneven Film Thickness:

Variations in electrical resistance across the target result in measurable differences in film thickness that may exceed acceptable limits.

6. Insufficient Target Purity:

Conductive metals are added to reduce electrical resistance. This measure may decrease the overall purity of the target material.