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  • VD0624 Copper-Nickel (Cu/Ni) vapour deposition materials

    • VD0624 Copper-Nickel (Cu/Ni) vapour deposition materials

    Catalogue Number VD0624
    Material Copper Nickel (Cu/Ni)
    Purity 99.9% ~ 99.999%
    Shape Powder/ Granule/ Custom-made

    Copper-Nickel (Cu/Ni) evaporation materials are used in vacuum deposition processes. They are composed of copper and nickel alloys that display specific electrical and thermal performance for thin-film applications. Stanford Advanced Materials (SAM) specialises in producing high-purity Copper-Nickel (Cu/Ni) evaporation materials.

    Related products: Aluminium-Nickel (Al/Ni) evaporation materials, Copper (Cu) evaporation materials

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    LAST RECOMMENDATION

    TA0001 Tantalum Ingot (Ta-Ingot)
    TA0002 Tantalum Foil, Tantalum Strips
    TA0003 Tantalum sheet, Tantalum plate
    TA0004 Tantalum tube, Tantalum tubes
    TA0005 Tantalum Rod, Tantalum Bar
    TA0006 Tantalum Wire (Ta-Wire)
    TA0007 Tantalum disc (Ta-disc)
    TA0008 Tantalum Mesh (Ta-Mesh)

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      Purity

      99.9%

      • 99.9%
      • 99%
      • 99.5%
      • 99.99%
      • 99.999%
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      Quantity

      500gram

      • 500gram
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      • 100gram
      • 1kg
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      Tel : (949) 407-8904
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