VD0638 Nickel-Copper (Ni/Cu) Vapour Deposition Materials

Description

Nickel-Copper (Ni/Cu) Evaporation Materials are essential components in physical evaporation processes. They consist of a mixture of nickel and copper that produces defined thermal stability, electrical conductivity and corrosion resistance. These properties allow their use in thin-film deposition across various applications. Given that they are compatible with semiconductor manufacturing processes, Nickel-Copper (Ni/Cu) Evaporation Materials find use in the electronics industry, particularly in the production of integrated circuits, microelectronic devices and sensors. Their composition is controlled and their deposition properties remain consistent, which ensures performance and compliance with strict quality standards in thin-film deposition.

Specification

Applications

1. Semiconductor Industry: Used for the production of metallisation layers, connecting wires and conductive coatings for integrated circuits (ICs), microelectronic devices and other semiconductor components.

2. Optical Coatings: Applied as anti-reflection and reflection coatings on optical lenses, objectives, mirrors and other optical components.

3. Electronics: Employed in the manufacture of electronic components such as resistors, inductors, sockets and wires.

4. Thermal Management: Utilised in the aerospace, automotive and electronics sectors for the manufacture of heat sinks, thermal transfer plates and thermal protection coatings.

5. Anti-Corrosion Coatings: Deployed in chemical plants, ships and marine applications to provide corrosion resistance.

6. Preparation of Metal Alloys: Used as one component in other metal alloys to improve mechanical properties and corrosion resistance.

Packaging

Our Nickel-Copper (Ni/Cu) Evaporation Materials are clearly marked and labelled to ensure proper identification and quality control. They are managed carefully to avoid damage during storage or transportation.