AC5592 Electrostatic Chuck (Al2O3)

Electrostatic Chuck Description:

The electrostatic chuck (ESC) is a crucial component used in semiconductor manufacturing equipment, particularly during plasma etching, chemical vapour deposition (CVD), and physical vapour deposition (PVD). It securely holds and releases semiconductor wafers or substrates during processing. The ESC operates on the principle of electrostatic force; when a voltage is applied, it generates an electrostatic field that clamps the wafer without physical contact, thereby ensuring uniform cooling and heating of the wafer, as well as excellent flatness and minimal contamination of the backside.

Electrostatic chucks (ESCs) made from Al2O3 or aluminium oxide are utilised in semiconductor fabrication facilities to securely hold and release semiconductor wafers during processing. Aluminium oxide is preferred due to its excellent electrical insulation properties, thermal conductivity, and chemical stability. In relation to an ESC, Al2O3 primarily serves as a dielectric material that facilitates the electrostatic clamping of semiconductor wafers.

Electrostatic Chuck Specifications:

Electrostatic Chuck Applications

• Plasma Etching and Cleaning: Securely holding wafers during etching processes, where precise material removal is required.
• Thin Film Deposition: Ensuring wafers remain stationary during the deposition of metal, dielectric, and semiconductor layers via CVD or PVD processes at controlled temperatures.
• Photolithography: Although less common, they can be used to hold wafers during the lithography process, where patterns are transferred onto the wafer surface.

Electrostatic Chuck Packaging

Our electrostatic Chuck is carefully handled during storage and transport to maintain the quality of our product in its original condition.